TLC251 Datasheet, PDF (3/18 Pages) Texas Instruments – LinCMOSE PROGRAMMABLE LOW-POWER OPERATIONAL AMPLIFIERS

TLC251, TLC251A, TLC251B, TLC251Y
LinCMOS™ PROGRAMMABLE
LOW-POWER OPERATIONAL AMPLIFIERS
SLOS001E – JULY 1983 – REVISED AUGUST 1994
TLC251Y chip information
These chips, properly assembled, display characteristics similar to the TLC251C. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(2)
(1)
(8)
48
VDD
(7)
(8)
BIAS SELECT
(7)
IN + ⁽³⁾ ₊
(2)
IN –
–
(6)
OUT
(1)
OFFSET N1
(5)
OFFSET N2
(4)
VDD _– /GND
(3)
(4)
(5)
55
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
TJMAX = 150°C
(6)
TOLERANCES ARE ± 10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
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