TL1963A-XX Datasheet, PDF (3/26 Pages) Texas Instruments – 1.5-A LOW-NOISE FAST-TRANSIENT-RESPONSE LOW-DROPOUT REGULATOR

TL1963A-xx
www.ti.com ........................................................................................................................................................ SLVS719A – JUNE 2008 – REVISED AUGUST 2008
ABSOLUTE MAXIMUM RATINGS⁽¹⁾
over operating free-air temperature range (unless otherwise noted)
V_IN Input voltage range
t_short
T_lead
T_J
T_stg
Output short-circuit duration
Maximum lead temperature
Operating virtual-junction temperature range
Storage temperature range
IN
OUT
Input-to-output differential⁽²⁾
SENSE
ADJ
SHDN
10-second soldering time
–20 V to 20 V
–20 V to 20 V
–20 V to 20 V
–20 V to 20 V
–7 V to 7 V
–20 V to 20 V
Indefinite
300°C
–40°C to 125°C
–65°C to 150°C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Absolute maximum input-to-output differential voltage cannot be achieved with all combinations of rated IN pin and OUT pin voltages.
With the IN pin at 20 V, the OUT pin may not be pulled below 0 V. The total measured voltage from IN to OUT cannot exceed ±20 V.
PACKAGE THERMAL DATA⁽¹⁾
PACKAGE
TO-263 (KTT)
BOARD
High K, JESD 51-5
θ_JA
26.5°C/W
θ_JC
31.8°C/W
θ_JP ⁽²⁾
0.38°C/W
(1) Maximum power dissipation is a function of T_J(max), θ_JA, and T_A. The maximum allowable power dissipation at any allowable ambient
temperature is P_D = (T_J(max) – T_A)/θ_JA. Operating at the absolute maximum T_J of 150°C can affect reliability.
(2) For packages with exposed thermal pads, such as QFN, PowerPAD™, and PowerFLEX™, θ_JP is defined as the thermal resistance
between the die junction and the bottom of the exposed pad.
Copyright © 2008, Texas Instruments Incorporated
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