THS4031 Datasheet, PDF (3/38 Pages) Texas Instruments – 100-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS

functional block diagram
THS4031, THS4032
100-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS
SLOS224C – JULY 1999 – REVISED APRIL 2000
VCC
Null
1
IN–
2
–
8
6
3
IN+
+
OUT
Figure 1. THS4031 – Single Channel
1IN– ²
1IN+ ³
–8
+
1
1OUT
2IN– ⁶
5
2IN+
–
+
4
7
2OUT
–VCC
Figure 2. THS4032 – Dual Channel
absolute maximum ratings over operating free-air temperature (unless otherwise noted)^†
Supply voltage, V_CC+ to V_CC– . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 V
Input voltage, V_I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±V_CC
Output current, I_O . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150 mA
Differential input voltage, V_IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±4 V
Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table
Operating free-air temperature, T_A: C-suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
I-suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to 85°C
M-suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –55°C to 125°C
Maximum junction temperature, T_J . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Storage temperature, T_stg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C
Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds, JG package . . . . . . . . . . . . . . . . . . . . 300°C
Case temperature for 60 seconds, FK package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
† _{Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and}
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
DISSIPATION RATING TABLE
PACKAGE
D
DGN§
θ_JA
(°C/W)
167‡
58.4
θ_JC
(°C/W)
38.3
4.7
TA = 25°C
POWER RATING
740 mW
2.14 W
JG
119
28
1050 mW
FK
87.7
20
1375 mW
‡ _{This data was taken using the JEDEC standard Low-K test PCB. For the JEDEC Proposed}
High-K test PCB, the θ_JA is 95°C/W with a power rating at TA = 25°C of 1.32 W.
§ _{This data was taken using 2 oz. trace and copper pad that is soldered directly to a 3-in. × 3-in.}
PC. For further information, refer to Application Information section of this data sheet.
• POST OFFICE BOX 655303 DALLAS, TEXAS 75265
3