THS3110IDGNR Datasheet, PDF (3/37 Pages) Texas Instruments – LOW-NOISE, HIGH-VOLTAGE, CURRENT-FEEDBACK

THS3110
THS3111
www.ti.com........................................................................................................................................ SLOS422E – SEPTEMBER 2003 – REVISED OCTOBER 2009
RECOMMENDED OPERATING CONDITIONS
Supply voltage
Dual supply
Single supply
Operating free-air temperature, T_A
Commercial
Industrial
Operating junction temperature, continuous operating temperature, T_J
Normal storage temperature, T_STG
MIN
NOM
MAX UNIT
±5
±15
V
10
30
0
+70
–40
+85
°C
–40
+125
–40
+85
ABSOLUTE MAXIMUM RATINGS⁽¹⁾
Over operating free-air temperature, unless otherwise noted.
Supply voltage, V_S– to V_S+
Input voltage, V_I
Differential input voltage, V_ID
Output current, I_O ⁽²⁾
Continuous power dissipation
Maximum junction temperature, T_J ⁽³⁾
Maximum junction temperature, continuous operation, long term reliability, T_J ⁽⁴⁾
Operating free-air temperature, T_A
Commercial
Industrial
Storage temperature, T_stg
ESD ratings:
HBM
CDM
MM
UNIT
33 V
± V_S
±4V
300 mA
See Dissipation Ratings Table
+150°C
+125°C
0°C to +70°C
–40°C to +85°C
–65°C to +125°C
900
1500
200
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The THS3110 and THS3111 may incorporate a PowerPAD on the underside of the chip. This feature acts as a heatsink and must be
connected to a thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction
temperature which could permanently damage the device. See TI Technical Brief SLMA002 for more information about utilizing the
PowerPAD™ thermally-enhanced package.
(3) The absolute maximum temperature under any condition is limited by the constraints of the silicon process.
(4) The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may
result in reduced reliability and/or lifetime of the device.
Copyright © 2003–2009, Texas Instruments Incorporated
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