SN74CB3Q3345 Datasheet, PDF (3/11 Pages) Texas Instruments – 8 BIT FET BUS SWITCH 2.5V/3.3V LOW VOLTAGE HIGH BANDWIDTH BUS SWITCH

SN74CB3Q3345
8ĆBIT FET BUS SWITCH
2.5ĆV/3.3ĆV LOWĆVOLTAGE HIGHĆBANDWIDTH BUS SWITCH
SCDS144A − OCTOBER 2003 − REVISED NOVEMBER 2003
simplified schematic, each FET switch (SW)
A
B
VCC
Charge
Pump
EN^†
† _{EN is the internal enable signal applied to the switch.}
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)^‡
Supply voltage range, V_CC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V
Control input voltage range, V_IN (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Switch I/O voltage range, V_I/O (see Notes 1, 2, and 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Control input clamp current, I_IK (V_IN < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
I/O port clamp current, I_I/OK (V_I/O < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
ON-state switch current, I_I/O (see Note 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±64 mA
Continuous current through V_CC or GND terminals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100 mA
Package thermal impedance, θ_JA (see Note 5): DBQ package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68°C/W
(see Note 5): DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92°C/W
(see Note 5): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
(see Note 6): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37°C/W
Storage temperature range, T_stg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
‡ _{Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and}
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltages are with respect to ground unless otherwise specified.
2. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
3. VI and VO are used to denote specific conditions for VI/O.
4. II and IO are used to denote specific conditions for II/O.
5. The package thermal impedance is calculated in accordance with JESD 51-7.
6. The package thermal impedance is calculated in accordance with JESD 51-5.
recommended operating conditions (see Note 7)
MIN MAX UNIT
VCC Supply voltage
2.3 3.6 V
VIH High-level control input voltage
VCC = 2.3 V to 2.7 V
VCC = 2.7 V to 3.6 V
1.7 5.5
V
2 5.5
VIL
Low-level control input voltage
VCC = 2.3 V to 2.7 V
VCC = 2.7 V to 3.6 V
0 0.7
V
0 0.8
VI/O Data input/output voltage
0 5.5 V
TA
Operating free-air temperature
−40 85 °C
NOTE 7: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
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