LP2985LV Datasheet, PDF (3/15 Pages) National Semiconductor (TI) – Micropower 150 mA Low-Noise Low-Dropout Regulator in SOT-23 and micro SMD packages for Applications

LP2985LV
150ĆmA LOWĆNOISE, LOWĆDROPOUT REGULATOR
WITH SHUTDOWN FOR OUTPUT VOLTAGES <2.3 V
SLVS552 − OCTOBER 2004
ORDERING INFORMATION
TJ
PART
GRADE
VOUT
(NOM)
PACKAGE†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING‡
1.25 V
Reel of 3000
Reel of 250
LP2985A-12DBVR
LP2985A-12DBVT
PREVIEW
1.35 V
Reel of 3000
Reel of 250
LP2985A-13DBVR
LP2985A-13DBVT
PREVIEW
1.5 V
1.7 V
SOT23-5 (DBV)
Reel of 3000
Reel of 250
Reel of 3000
Reel of 250
LP2985A-15DBVR
LP2985A-15DBVT
LP2985A-17DBVR
LP2985A-17DBVT
PREVIEW
PREVIEW
1.8 V
Reel of 3000
Reel of 250
LP2985A-18DBVR
LP2985A-18DBVT
LPT_
2V
1.25 V
Reel of 3000
Reel of 250
LP2985A-20DBVR
LP2985A-20DBVT
LP2985A-12YEQR
PREVIEW
PREVIEW
A grade:
−40°C to 125°C _{1% tolerance}
1.35 V
1.5 V
1.7 V
1.8 V
2V
1.25 V
1.35 V
1.5 V
1.7 V
1.8 V
2V
NanoStar − WCSP
0.17-mm Bump (YEQ)
NanoFree − WCSP
0.17-mm Bump
(YZQ, Pb-free)
Reel of 3000
Reel of 3000
LP2985A-13YEQR
LP2985A-15YEQR
LP2985A-17YEQR
LP2985A-18YEQR
LP2985A-20YEQR
LP2985A-12YZQR
LP2985A-13YZQR
LP2985A-15YZQR
LP2985A-17YZQR
LP2985A-18YZQR
LP2985A-20YZQR
PREVIEW
PREVIEW
PREVIEW
PREVIEW
PREVIEW
PREVIEW
PREVIEW
PREVIEW
PREVIEW
PREVIEW
PREVIEW
1.25 V
1.35 V
1.5 V
1.7 V
1.8 V
2V
NanoStar − WCSP
0.30-mm Bump (YEU)
Reel of 3000
LP2985A-12YEUR
LP2985A-13YEUR
LP2985A-15YEUR
LP2985A-17YEUR
LP2985A-18YEUR
LP2985A-20YEUR
PREVIEW
PREVIEW
PREVIEW
PREVIEW
PREVIEW
PREVIEW
1.25 V
LP2985A-12YZUR
PREVIEW
1.35 V
LP2985A-13YZUR PREVIEW
1.5 V
1.7 V
1.8 V
NanoFree − WCSP
0.30-mm Bump
(YZU, Pb-free)
Reel of 3000
LP2985A-15YZUR
LP2985A-17YZUR
LP2985A-18YZUR
PREVIEW
PREVIEW
PREVIEW
2V
LP2985A-20YZUR PREVIEW
† _{Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at}
www.ti.com/sc/package.
‡ _{DBV: The actual top-side marking has one additional character that designates the assembly/test site.}
YEQ/YZQ, YEU/YZU: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
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