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BQ24079 Datasheet, PDF (3/39 Pages) Texas Instruments – 1.5A USB-FRIENDLY Li-Ion BATTERY CHARGER AND POWER-PATH MANAGEMENT IC
bq24072, bq24073
bq24074, bq24075, bq24079
www.ti.com................................................................................................................................................. SLUS810D – SEPTEMBER 2008 – REVISED JUNE 2009
ABSOLUTE MAXIMUM RATINGS(1)
over the 0°C to 125°C operating free-air temperature range (unless otherwise noted)
VI
Input Voltage
II
Input Current
IO
Output Current
(Continuous)
Output Sink Current
TJ
Junction temperature
Tstg Storage temperature
IN (with respect to VSS)
BAT (with respect to VSS)
OUT, EN1, EN2, CE, TS, ISET, PGOOD, CHG, ILIM, TMR, ITERM,
SYSOFF, TD (with respect to VSS)
IN
OUT
BAT (Discharge mode)
BAT (Charging mode)
CHG, PGOOD
VALUE
–0.3 to 28
–0.3 to 5
–0.3 to 7
1.6
5
5
1.5 (2)
15
–40 to 150
–65 to 150
UNIT
V
V
V
A
A
A
A
mA
°C
°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage
values are with respect to the network ground terminal unless otherwise noted.
(2) The IC operational charging life is reduced to 20,000 hours, when charging at 1.5A and 125°C. The thermal regulation feature reduces
charge current if the IC’s junction temperature reaches 125°C; thus without a good thermal design the maximum programmed charge
current may not be reached.
DISSIPATION RATINGS
PACKAGE (1)
RGT (2)
RθJA
39.47 °C/W
RθJC
2.4 °C/W
POWER RATING
TA ≤ 25°C
2.3 W
TA = 85°C
225mW
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(2) This data is based on using the JEDEC High-K board and the exposed die pad is connected to a Cu pad on the board. The pad is
connected to the ground plane by a 2x3 via matrix.
RECOMMENDED OPERATING CONDITIONS
VI
IIN
IOUT
IBAT
ICHG
TJ
RILIM
RISET
RITERM
RTMR
IN voltage range
IN operating voltage range
’72, ’73, ‘75, '79
‘74
Input current, IN pin
Current, OUT pin
Current, BAT pin (Discharging)
Current, BAT pin (Charging)
Junction Temperature
Maximum input current programming resistor
Fast-charge current programming resistor (2)
Termination current programming resistor
Timer programming resistor
MIN
4.35
4.35
4.35
–40
1100
590
0
18
MAX
26
6.4
10.2
1.5
4.5
4.5
1.5 (1)
125
8000
3000
15
72
UNIT
V
V
A
A
A
A
°C
Ω
Ω
kΩ
kΩ
(1) The IC operational charging life is reduced to 20,000 hours, when charging at 1.5A and 125°C. The thermal regulation feature reduces
charge current if the IC’s junction temperature reaches 125°C; thus without a good thermal design the maximum programmed charge
current may not be reached.
(2) Use a 1% tolerance resistor for RISET to avoid issues with the RISET short test when using the maximum charge current setting.
Copyright © 2008–2009, Texas Instruments Incorporated
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