TPS65251-1_15 Datasheet, PDF (29/39 Pages) Texas Instruments – TPS65251-x 4.5-V to 18-V Input, High Current, Synchronous Step Down Three Buck Switchers With Integrated FET

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TPS65251-1, TPS65251-2, TPS65251-3
SLVSC70A – JANUARY 2015 – REVISED JANUARY 2015
9 Power Supply Recommendations
The device is designed to operate from an input voltage supply range between 4.5 V and 18 V. This input power
supply should be well regulated. If the input supply is located more than a few inches from the TPS65251-x
converter, additional bulk capacitance may be required in addition to the ceramic bypass capacitors. An
electrolytic capacitor with a value of 47 μF is a typical choice.
10 Layout
10.1 Layout Guidelines
Layout is a critical portion of PMIC designs.
• Place VOUT, and LX on the top layer and an inner power plane for VIN.
• Fit also on the top layer connections for the remaining pins of the PMIC and a large top side area filled with
ground.
• The top layer ground area sould be connected to the internal ground layer(s) using vias at the input bypass
capacitor, the output filter cpacitor and directly under the TPS65251-x device to provide a thermal path from
the Powerpad land to ground.
• The AGND pin should be tied directly to the power pad under the IC and the power pad.
• For operation at full rated load, the top side ground area together with the internal ground plane, must provide
adequate heat dissipating area.
• There are several signals paths that conduct fast changing currents or voltages that can interact with stray
inductance or parasitic capacitance to generate noise or degrade the power supplies performance. To help
eliminate these problems, the VIN pin should be bypassed to ground with a low ESR ceramic bypass
capacitor with X5R or X7R dielectric. Care should be taken to minimize the loop area formed by the bypass
capacitor connections, the VIN pins, and the ground connections. Since the LX connection is the switching
node, the output inductor should be located close to the LX pins, and the area of the PCB conductor
minimized to prevent excessive capacitive coupling.
• The output filter capacitor ground should use the same power ground trace as the VIN input bypass capacitor.
Try to minimize this conductor length while maintaining adequate width.
• The compensation should be as close as possible to the COMP pins. The COMP and OSC pins are sensitive
to noise so the components associated to these pins should be located as close as possible to the IC and
routed with minimal lengths of trace.
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Product Folder Links: TPS65251-1 TPS65251-2 TPS65251-3