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LMV321DBVR Datasheet, PDF (28/45 Pages) Texas Instruments – LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
www.ti.com
PACKAGE MATERIALS INFORMATION
15-Oct-2013
Device
LMV324IDR
LMV324IDRG4
LMV324IPWR
LMV324IPWRG4
LMV324QDR
LMV324QPWR
LMV358IDDUR
LMV358IDGKR
LMV358IDR
LMV358IDR
LMV358IDR
LMV358IDRG4
LMV358IDRG4
LMV358IPWR
LMV358QDDUR
LMV358QDGKR
LMV358QDR
Package Type
SOIC
SOIC
TSSOP
TSSOP
SOIC
TSSOP
VSSOP
VSSOP
SOIC
SOIC
SOIC
SOIC
SOIC
TSSOP
VSSOP
VSSOP
SOIC
Package Drawing Pins
D
14
D
14
PW
14
PW
14
D
14
PW
14
DDU
8
DGK
8
D
8
D
8
D
8
D
8
D
8
PW
8
DDU
8
DGK
8
D
8
SPQ
2500
2500
2000
2000
2500
2000
3000
2500
2500
2500
2500
2500
2500
2000
3000
2500
2500
Length (mm)
364.0
333.2
364.0
367.0
367.0
367.0
202.0
358.0
364.0
367.0
340.5
340.5
367.0
364.0
202.0
358.0
340.5
Width (mm)
364.0
345.9
364.0
367.0
367.0
367.0
201.0
335.0
364.0
367.0
338.1
338.1
367.0
364.0
201.0
335.0
338.1
Height (mm)
27.0
28.6
27.0
35.0
38.0
35.0
28.0
35.0
27.0
35.0
20.6
20.6
35.0
27.0
28.0
35.0
20.6
Pack Materials-Page 3