LMZ10504_15 Datasheet, PDF (27/35 Pages) Texas Instruments – 4A SIMPLE SWITCHER Power Module With 5.5-V Maximum Input Voltage

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LMZ10504
SNVS610N – DECEMBER 2009 – REVISED SEPTEMBER 2015
10.4 Power Module SMT Guidelines
The recommendations below are for a standard module surface mount assembly.
• Land Pattern – Follow the PCB land pattern with either soldermask defined or non-soldermask defined pads
• Stencil Aperture
– For the exposed die attach pad (DAP), adjust the stencil for approximately 80% coverage of the PCB land
pattern
– For all other I/O pads use a 1:1 ratio between the aperture and the land pattern recommendation
• Solder Paste – Use a standard SAC Alloy such as SAC 305, type 3 or higher
• Stencil Thickness – 0.125 to 0.15 mm
• Reflow - Refer to solder paste supplier recommendation and optimized per board size and density
• Maximum number of reflows allowed is one
• Refer to AN Design Summary LMZ1xxx and LMZ2xxx Power Modules Family (SNAA214) for reflow
information.
Figure 35. Sample Reflow Profile
PROBE
1
2
3
MAX TEMP
(°C)
242.5
242.5
241.0
Table 11. Sample Reflow Profile Table
REACHED
MAX TEMP
6.58
7.10
7.09
TIME ABOVE
235°C
0.49
0.55
0.42
REACHED
235°C
6.39
6.31
6.44
TIME ABOVE
245°C
0.00
0.00
0.00
REACHED
245°C
–
7.10
–
TIME ABOVE
260°C
0.00
0.00
0.00
REACHED
260°C
–
–
–
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