LMV358DR Datasheet, PDF (27/45 Pages) Texas Instruments – LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS

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PACKAGE MATERIALS INFORMATION
15-Oct-2013
Device
LMV358IDR
LMV358IDR
LMV358IDRG4
LMV358IDRG4
LMV358IPWR
LMV358QDDUR
LMV358QDGKR
LMV358QDR
Package Package Pins
Type Drawing
SOIC
D
8
SOIC
D
8
SOIC
D
8
SOIC
D
8
TSSOP PW
8
VSSOP DDU 8
VSSOP DGK 8
SOIC
D
8
SPQ
2500
2500
2500
2500
2000
3000
2500
2500
Reel Reel A0 B0 K0 P1 W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
330.0 12.4 6.4 5.2 2.1 8.0 12.0
Q1
330.0 12.4 6.4 5.2 2.1 8.0 12.0
Q1
330.0 12.4 6.4 5.2 2.1 8.0 12.0
Q1
330.0 12.4 6.4 5.2 2.1 8.0 12.0
Q1
330.0 12.4 7.0 3.6 1.6 8.0 12.0
Q1
180.0
8.4 2.25 3.35 1.05 4.0 8.0
Q3
330.0 12.4 5.3 3.4 1.4 8.0 12.0
Q1
330.0 12.4 6.4 5.2 2.1 8.0 12.0
Q1
*All dimensions are nominal
Device
LMV321IDBVR
LMV321IDBVR
LMV321IDBVT
LMV321IDBVT
LMV321IDCKR
LMV321IDCKR
LMV321IDCKT
LMV321IDCKT
LMV324IDR
Package Type
SOT-23
SOT-23
SOT-23
SOT-23
SC70
SC70
SC70
SC70
SOIC
Package Drawing Pins
DBV
5
DBV
5
DBV
5
DBV
5
DCK
5
DCK
5
DCK
5
DCK
5
D
14
SPQ
3000
3000
250
250
3000
3000
250
250
2500
Length (mm)
205.0
180.0
205.0
180.0
205.0
180.0
205.0
180.0
333.2
Width (mm)
200.0
180.0
200.0
180.0
200.0
180.0
200.0
180.0
345.9
Height (mm)
33.0
18.0
33.0
18.0
33.0
18.0
33.0
18.0
28.6
Pack Materials-Page 2