TLV2731CDBVR Datasheet, PDF (26/31 Pages) Texas Instruments – Advanced LinCMOS RAIL-TO-RAIL

TLV2731, TLV2731Y
Advanced LinCMOS RAIL-TO-RAIL
LOW-POWER SINGLE OPERATIONAL AMPLIFIERS
SLOS198A – AUGUST 1997 – REVISED MARCH 2001
APPLICATION INFORMATION
macromodel information
Macromodel information provided was derived using Microsim Parts, the model generation software used
with Microsim PSpice . The Boyle macromodel (see Note 6) and subcircuit in Figure 56 are generated using
the TLV2731 typical electrical and operating characteristics at T_A = 25°C. Using this information, output
simulations of the following key parameters can be generated to a tolerance of 20% (in most cases):
D Maximum positive output voltage swing
D Maximum negative output voltage swing
D Slew rate
D Quiescent power dissipation
D Input bias current
D Open-loop voltage amplification
D Unity-gain frequency
D Common-mode rejection ratio
D Phase margin
D DC output resistance
D AC output resistance
D Short-circuit output current limit
NOTE 6: G. R. Boyle, B. M. Cohn, D. O. Pederson, and J. E. Solomon, “Macromodeling of Integrated Circuit Operational Amplifiers,” IEEE Journal
of Solid-State Circuits, SC-9, 353 (1974).
VDD ₊
RP
2
IN –
IN +
1
3
RSS
ISS
10
DP
J1
J2
11
RD1
12
C1
RD2
+
VC
R2
–
53
DC
99
EGND ₊
9
+
VB
–
FB
–
C2
6
GCM
GA
DLN
RO2 ⁹⁰
HLIM
+ _DLP
–
91
+
VLP
–
7
+
VLIM
–
8
92
–
VLN
+
VDD _–
VAD
+
–
4
60
DE
54
–+
VE
RO1
5
OUT
.SUBCKT TLV2731 1 2 3 4 5
C1
11 12 13.51E–12
C2
6 7 50.00E–12
DC
5 53 DX
DE
54 5 DX
DLP 90 91 DX
DLN 92 90 DX
DP
4 3 DX
EGND 99 0 POLY (2) (3,0) (4,0) 0 .5 .5
FB
7 99 POLY (5) VB VC VE VLP
+ VLN 0 90.83E3 –10E3 10E3 10E3 –10E3
GA
6 0 11 12 314.2E–6
GCM 0 6 10 99 242.35E–9
ISS
3 10 DC 87.00E–6
HLIM 90 0 VLIM 1K
J1
11 2 10 JX
J2
12 1 10 JX
R2
6 9 100.0E3
RD1 60 11 3.183E3
RD2 60 12 3.183E3
R01
8
5 25
R02
7
99 25
RP
3 4 6.553E3
RSS 10 99 2.500E6
VAD 60 4 –.5
VB
9 0 DC 0
VC
3 53 DC .795
VE
54 4 DC .795
VLIM 7 8 DC 0
VLP
91 0 DC 12.4
VLN 0 92 DC 17.4
.MODEL DX D (IS=800.0E–18)
.MODEL JX PJF (IS=500.0E–15 BETA=2.939E–3
+ VTO=–.065)
.ENDS
Figure 56. Boyle Macromodel and Subcircuit
PSpice and Parts are trademark of MicroSim Corporation.
Macromodels, simulation models, or other models provided by TI,
directly or indirectly, are not warranted by TI as fully representing
all of the specification and operating characteristics of the
semiconductor product to which the model relates.
26
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