LT1013 Datasheet, PDF (25/33 Pages) Linear Technology – Quad Precision Op Amp

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PACKAGE OPTION ADDENDUM
22-Aug-2007
Orderable Device
LT1013DIP
LT1013DIPE4
LT1013DMD
LT1013DMDG4
LT1013DP
LT1013DPE4
LT1013IP
LT1013MFKB
LT1013MJG
LT1013MJGB
LT1013MP
LT1013Y
Status ⁽¹⁾
ACTIVE
Package
Type
PDIP
Package
Drawing
P
ACTIVE
PDIP
P
ACTIVE
SOIC
D
ACTIVE
SOIC
D
ACTIVE
PDIP
P
ACTIVE
PDIP
P
OBSOLETE PDIP
P
ACTIVE
LCCC
FK
ACTIVE
CDIP
JG
ACTIVE
CDIP
JG
OBSOLETE PDIP
P
OBSOLETE XCEPT
Y
Pins Package Eco Plan ⁽²⁾ Lead/Ball Finish MSL Peak Temp ⁽³⁾
Qty
8
50
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
8
50
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
8
75
TBD
CU NIPDAU Level-1-220C-UNLIM
8
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8
50
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
8
50
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
8
TBD
Call TI
Call TI
20
1
TBD
POST-PLATE N / A for Pkg Type
8
1
TBD
A42 SNPB N / A for Pkg Type
8
1
TBD
A42 SNPB N / A for Pkg Type
8
TBD
Call TI
Call TI
0
TBD
Call TI
Call TI
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check}
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) _{MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder}
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2