LMZ31704_15 Datasheet, PDF (25/33 Pages) Texas Instruments – 4A SIMPLE SWITCHER® Power Module with 2.95V-17V Input and Current Sharing

LMZ31704
www.ti.com
SLVSBV8A – JUNE 2013 – REVISED AUGUST 2013
Layout Considerations
To achieve optimal electrical and thermal performance, an optimized PCB layout is required. Figure 43 thru
Figure 46, shows a typical PCB layout. Some considerations for an optimized layout are:
• Use large copper areas for power planes (PVIN, VOUT, and PGND) to minimize conduction loss and thermal
stress.
• Place ceramic input and output capacitors close to the device pins to minimize high frequency noise.
• Locate additional output capacitors between the ceramic capacitor and the load.
• Keep AGND and PGND separate from one another.
• Place R_SET, R_RT, and C_SS as close as possible to their respective pins.
• Use multiple vias to connect the power planes to internal layers.
Figure 43. Typical Top-Layer Layout
Figure 44. Typical Layer-2 Layout
Figure 45. Typical Layer 3 Layout
Figure 46. Typical Bottom-Layer Layout
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