LMZ20501_15 Datasheet, PDF (25/34 Pages) Texas Instruments – LMZ14203H SIMPLE SWITCHER® 6V to 42V, 3A High Output Voltage Power Module

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11.2 Layout Example
TOP
VIEW
LMZ20501
SNVS874C – AUGUST 2012 – REVISED APRIL 2015
EP
RFBT
CFF
RFBB
CIN
COUT
VIN
GND
VOUT
Top Trace
Bottom Trace
Figure 39. Example PCB Layout
11.3 Soldering Information
Proper operation of the LMZ20501 requires that it be correctly soldered to the PCB. This is especially true
regarding the EP. This pad acts as a quiet ground reference for the device and a heatsink connection. Use the
following recommendations when utilizing machine placement of the device:
• Dimension of area for pick-up: 2 mm x 2.5 mm.
• Use a nozzle size of less than 1.3 mm in diameter, so that the head does not touch the outer area of the
package.
• Use a soft tip pick-and-place head.
• Add 0.05 mm to the component thickness so that the device will be released 0.05 mm into the solder paste
without putting pressure or splashing the solder paste.
• Slow the pick arm when picking the part from the tape and reel carrier and when depositing the device on the
board.
• If the machine releases the component by force, use the minimum force and no more than 3 N.
• For PCBs with surface mount components on both sides, it is suggested to put the LMZ20501 on the top
side. In case the application requires bottom side placement, a re-flow fixture may be required to protect the
module during the second reflow.
In addition, please follow the important guidelines found in: SNOA401. The curves in Figure 40 and Figure 41
show typical soldering temperature profiles.
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Product Folder Links: LMZ20501
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