THS4081 Datasheet, PDF (23/24 Pages) Texas Instruments – 175-MHz LOW-POWER HIGH-SPEED AMPLIFIERS

DGN (S-PDSO-G8)
0,65
8
THS4081, THS4082
175-MHz LOW-POWER HIGH-SPEED AMPLIFIERS
SLOS274C – DECEMBER 1999 – REVISED MAY 2000
MECHANICAL INFORMATION
PowerPAD™ PLASTIC SMALL-OUTLINE PACKAGE
0,38
0,25
5
0,25 M
3,05 4,98
2,95 4,78
Thermal Pad
(See Note D)
0,15 NOM
1
4
3,05
2,95
Gage Plane
0°– 6°
0,25
0,69
0,41
1,07 MAX
0,15
0,05
Seating Plane
0,10
4073271/A 01/98
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions include mold flash or protrusions.
D. The package thermal performance may be enhanced by attaching an external heat sink to the thermal pad. This pad is electrically
and thermally connected to the backside of the die and possibly selected leads.
E. Falls within JEDEC MO-187
PowerPAD is a trademark of Texas Instruments.
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