CC1100E Datasheet, PDF (23/98 Pages) Texas Instruments – Low-Power Sub-GHz RF Transceiver(470-510 MHz & 950-960 MHz)

100%. See Figure 8 for top solder resist and
top paste masks.
Each decoupling capacitor should be placed
as close as possible to the supply pin it
decouples. Each decoupling capacitor should
be connected to the power line (or power
plane) by separate vias. The best routing is
from the power line (or power plane) to the
decoupling capacitor and then to the CC1100E
supply pin. Supply power filtering is very
important.
Each decoupling capacitor ground pad should
be connected to the ground plane by separate
vias. Direct connections between neighboring
power pins will increase noise coupling and
should be avoided unless absolutely
necessary. Routing in the ground plane
underneath the chip or the balun/RF matching
circuit, or between the chip’s ground vias and
the decoupling capacitor’s ground vias should
CC1100E
be avoided. This improves the grounding and
ensures the shortest possible current return
path.
The external components should ideally be as
small as possible (0402 is recommended) and
surface mount devices are highly
recommended. Please note that components
with different sizes than those specified may
have differing characteristics.
Precaution should be used when placing the
microcontroller in order to avoid noise
interfering with the RF circuitry.
A CC1100E DK Development Kit with a fully
assembled CC1100E EM Evaluation Module is
available. It is strongly advised that this
reference layout is followed very closely in
order to get the best performance. The
schematic, BOM and layout Gerber files are all
available from the TI website ([3] and 0).
Figure 8: Left: Top Solder Resist Mask (Negative). Right: Top Paste Mask. Circles are Vias
8 Configuration Overview
The CC1100E can be configured to achieve
optimum performance for many different
applications. Configuration is done using the
SPI interface. See Section 10 below for more
description of the SPI interface. The following
key parameters can be programmed:
 Power-down / power up mode
 Crystal oscillator power-up / power-down
 Receive / transmit mode
 RF channel selection
 Data rate
 Modulation format
 RX channel filter bandwidth
 RF output power
 Data buffering with separate 64-byte
receive and transmit FIFOs
 Packet radio hardware support
 Forward Error Correction (FEC) with
interleaving
 Data whitening
 Wake-On-Radio (WOR)
Details of each configuration register can be
found in Section 29, starting on page 59.
Figure 9 shows a simplified state diagram that
explains the main CC1100E states together with
typical usage and current consumption. For
detailed information on controlling the CC1100E
state machine, and a complete state diagram,
see Section 19, starting on page 45.
SWRS082
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