TMP103_15 Datasheet, PDF (22/24 Pages) Texas Instruments – Low-Power, Digital Temperature Sensor with Two-Wire Interface in WCSP

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EXAMPLE BOARD LAYOUT
DSBGA - 0.625 mm max height
DIE SIZE BALL GRID ARRAY
4X 0.23 0.02
1
A
(0.4) TYP
2
(0.4) TYP
B
SYMM
SYMM
LAND PATTERN EXAMPLE
SCALE:50X
( 0.23)
METAL
0.05 MAX
0.05 MIN
METAL
UNDER
MASK
SOLDER MASK
OPENING
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
( 0.23)
SOLDER MASK
OPENING
SOLDER MASK DETAILS
NOT TO SCALE
NOTES: (continued)
4. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For more information, see Texas Instruments literature number SBVA017 (www.ti.com/lit/sbva017).
4219460/A 02/2014
www.ti.com