TLC080A Datasheet, PDF (22/52 Pages) Texas Instruments – FAMILY OF WIDE BANDWIDTH HIGH OUTPUT DRIVE SINGLE SUPPLY OPERATIONAL AMPLIFIERS

TLC080, TLC081, TLC082, TLC083, TLC084, TLC085, TLC08xA
FAMILY OF WIDEĆBANDWIDTH HIGHĆOUTPUTĆDRIVE SINGLE SUPPLY
OPERATIONAL AMPLIFIERS
SLOS254D − JUNE 1999 − REVISED FEBRUARY 2004
APPLICATION INFORMATION
general PowerPAD design considerations
The TLC08x is available in a thermally-enhanced PowerPAD family of packages. These packages are
constructed using a downset leadframe upon which the die is mounted [see Figure 52(a) and Figure 52(b)]. This
arrangement results in the lead frame being exposed as a thermal pad on the underside of the package [see
Figure 52(c)]. Because this thermal pad has direct thermal contact with the die, excellent thermal performance
can be achieved by providing a good thermal path away from the thermal pad.
The PowerPAD package allows for both assembly and thermal management in one manufacturing operation.
During the surface-mount solder operation (when the leads are being soldered), the thermal pad can also be
soldered to a copper area underneath the package. Through the use of thermal paths within this copper area,
heat can be conducted away from the package into either a ground plane or other heat dissipating device.
The PowerPAD package represents a breakthrough in combining the small area and ease of assembly of
surface mount with the, heretofore, awkward mechanical methods of heatsinking.
DIE
Side View (a)
Thermal
Pad
DIE
End View (b)
Bottom View (c)
NOTE B: The thermal pad is electrically isolated from all terminals in the package.
Figure 52. Views of Thermally Enhanced DGN Package
Although there are many ways to properly heatsink the PowerPAD package, the following steps illustrate the
recommended approach.
Thermal Pad Area
Single or Dual
Quad
68 mils x 70 mils with 5 vias
(Via diameter = 13 mils)
78 mils x 94 mils with 9 vias
(Via diameter = 13 mils)
Figure 53. PowerPAD PCB Etch and Via Pattern
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