BQ2057DGKR Datasheet, PDF (22/24 Pages) Texas Instruments – ADVANCED LINEAR CHARGE MANAGEMENT IC FOR SINGLE AND TWO CELL LITHIUM-POLYMER

www.ti.com
PACKAGE OPTION ADDENDUM
4-Mar-2005
PACKAGING INFORMATION
Orderable Device
BQ2057CDGK
BQ2057CDGKR
BQ2057CSN
BQ2057CSNTR
BQ2057CTS
BQ2057CTSTR
BQ2057DGK
BQ2057DGKR
BQ2057PDGK
BQ2057PDGKR
BQ2057SN
BQ2057SNTR
BQ2057TS
BQ2057TSN
BQ2057TSNTR
BQ2057TSTR
BQ2057TTS
BQ2057TTSTR
BQ2057WSN
BQ2057WSNTR
BQ2057WTS
BQ2057WTSTR
Status ⁽¹⁾
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package
Type
MSOP
MSOP
SOIC
SOIC
TSSOP
TSSOP
MSOP
MSOP
MSOP
MSOP
SOIC
SOIC
TSSOP
SOIC
SOIC
TSSOP
TSSOP
TSSOP
SOIC
SOIC
TSSOP
TSSOP
Package
Drawing
DGK
DGK
D
D
PW
PW
DGK
DGK
DGK
DGK
D
D
PW
D
D
PW
PW
PW
D
D
PW
PW
Pins Package Eco Plan ⁽²⁾ Lead/Ball Finish MSL Peak Temp ⁽³⁾
Qty
8
80
None
CU NIPDAU Level-1-220C-UNLIM
8 2500
None
CU NIPDAU Level-1-220C-UNLIM
8
75
None
CU SNPB Level-1-220C-UNLIM
8 2500
None
CU SNPB Level-1-220C-UNLIM
8 150
None
CU NIPDAU Level-1-220C-UNLIM
8 2000
None
CU NIPDAU Level-1-220C-UNLIM
8
80
None
CU NIPDAU Level-1-220C-UNLIM
8 2500
None
CU NIPDAU Level-1-220C-UNLIM
8
80
None
CU NIPDAU Level-1-220C-UNLIM
8 2500
None
CU NIPDAU Level-1-220C-UNLIM
8
75
None
CU SNPB Level-1-220C-UNLIM
8 2500
None
CU SNPB Level-1-220C-UNLIM
8 150
None
CU NIPDAU Level-1-220C-UNLIM
8
75
None
CU SNPB Level-1-220C-UNLIM
8 2500
None
CU SNPB Level-1-220C-UNLIM
8 2000
None
CU NIPDAU Level-1-220C-UNLIM
8 150
None
CU NIPDAU Level-1-220C-UNLIM
8 2000
None
CU NIPDAU Level-1-220C-UNLIM
8
75
None
CU SNPB Level-1-220C-UNLIM
8 2500
None
CU SNPB Level-1-220C-UNLIM
8 150
None
CU NIPDAU Level-1-220C-UNLIM
8 2000
None
CU NIPDAU Level-1-220C-UNLIM
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional}
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3) _{MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder}
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
Addendum-Page 1