THS4061 Datasheet, PDF (21/22 Pages) Texas Instruments – 180-MHz HIGH-SPEED AMPLIFIERS

JG (R-GDIP-T8)
THS4061, THS4062
180-MHz HIGH-SPEED AMPLIFIERS
SLOS234D – DECEMBER 1998 – REVISED FEBRUARY 2000
MECHANICAL INFORMATION
CERAMIC DUAL-IN-LINE PACKAGE
0.400 (10,20)
0.355 (9,00)
8
5
0.280 (7,11)
0.245 (6,22)
1
4
0.065 (1,65)
0.045 (1,14)
0.020 (0,51) MIN
0.310 (7,87)
0.290 (7,37)
0.200 (5,08) MAX
Seating Plane
0.130 (3,30) MIN
0.063 (1,60)
0.015 (0,38)
0.100 (2,54)
0.023 (0,58)
0.015 (0,38)
0.014 (0,36)
0.008 (0,20)
0°–15°
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification only on press ceramic glass frit seal only.
E. Falls within MIL-STD-1835 GDIP1-T8
4040107/C 08/96
• POST OFFICE BOX 655303 DALLAS, TEXAS 75265
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