THS4021 Datasheet, PDF (21/22 Pages) Texas Instruments – 350-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS

DGN (S-PDSO-G8)
0,65
8
THS4021, THS4022
350-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS
SLOS265B – SEPTEMBER 1999 – REVISED FEBRUARY 2000
MECHANICAL INFORMATION
PowerPAD™ PLASTIC SMALL-OUTLINE PACKAGE
0,38
0,25
5
0,25 M
3,05 4,98
2,95 4,78
Thermal Pad
(See Note D)
0,15 NOM
1
4
3,05
2,95
Gage Plane
0°– 6°
0,25
0,69
0,41
1,07 MAX
0,15
0,05
Seating Plane
0,10
4073271/A 01/98
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions include mold flash or protrusions.
D. The package thermal performance may be enhanced by attaching an external heat sink to the thermal pad. This pad is electrically
and thermally connected to the backside of the die and possibly selected leads.
E. Falls within JEDEC MO-187
PowerPAD is a trademark of Texas Instruments Incorporated.
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