LP2986_15 Datasheet, PDF (21/33 Pages) Texas Instruments – LP2986 Micropower, 200-mA Ultra-Low-Dropout Fixed or Adjustable Voltage Regulator

www.ti.com
LP2986
SNVS137I – MARCH 1999 – REVISED SEPTEMBER 2015
10.3 WSON Mounting
The LDC08A (pullback) 8-pin WSON package requires specific mounting techniques which are detailed in Texas
Instruments Application Note Leadless Leadframe Package (LLP) (SNOA401). Referring to the section PCB
Design Recommendations in SNOA401, the pad style which should be used with this WSON package is the
NSMD (non-solder mask defined) type. Additionally, for optimal reliability, there is a recommended 1:1 ratio
between the package pad and the PCB pad for the pullback WSON.
The thermal dissipation of the WSON package is directly related to the printed circuit board construction and the
amount of additional copper area connected to the DAP.
The DAP (exposed pad) on the bottom of the WSON package is connected to the die substrate with a conductive
die attach adhesive. The DAP has no direct electrical (wire) connection to any of the eight pins. There is a
parasitic PN junction between the die substrate and the device ground. As such, it is strongly recommend that
the DAP be connected directly to the ground at device pin 1 (GROUND). Alternately, but not recommended, the
DAP may be left floating (that is, no electrical connection). The DAP must not be connected to any potential other
than ground.
For the LP2986 in the NGN 8-pin WSON package, the junction-to-case thermal rating (R_θJC) is 4.4°C/W, where
the case is on the bottom of the package at the center of the DAP.
Copyright © 1999–2015, Texas Instruments Incorporated
Product Folder Links: LP2986
Submit Documentation Feedback
21