THS4061_08 Datasheet, PDF (20/30 Pages) Texas Instruments – 180-MHz HIGH-SPEED AMPLIFIERS

www.ti.com
PACKAGE OPTION ADDENDUM
7-Nov-2007
Orderable Device
THS4062CDGNRG4
THS4062CDR
THS4062CDRG4
THS4062ID
THS4062IDG4
THS4062IDGN
THS4062IDGNG4
THS4062IDGNR
THS4062IDGNRG4
THS4062IDR
THS4062IDRG4
Status ⁽¹⁾
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package
Type
Power
PAD
MSOP-
Power
PAD
SOIC
Package
Drawing
DGN
D
SOIC
D
SOIC
D
SOIC
D
MSOP-
Power
PAD
MSOP-
Power
PAD
MSOP-
Power
PAD
MSOP-
Power
PAD
SOIC
DGN
DGN
DGN
DGN
D
SOIC
D
Pins Package Eco Plan ⁽²⁾
Qty
no Sb/Br)
Lead/Ball Finish
MSL Peak Temp ⁽³⁾
8
TBD
Call TI
Call TI
8 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8
80 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8
80 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check}
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) _{MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder}
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
Addendum-Page 2