UCC3912 Datasheet, PDF (2/6 Pages) Texas Instruments – Programmable Hot Swap Power Manager

UCC3912
ABSOLUTE MAXIMUM RATINGS
VIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +8 V
FAULT Sink Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50mA
FAULT Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 to V_IN
Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . Self Limiting
Input Voltage
(B0, B1, B2, B3, IMAX, SHTDWN) . . . . . . . . . . . –0.3 to V_IN
Storage Temperature Range . . . . . . . . . . . . . –65°C to +150°C
Operating Junction Temperature Range . . . . –55°C to +150°C
Lead Temperature (Soldering, 10 sec.) . . . . . . . . . . . . . +300°C
Currents are positive into, negative out of the specified termi-
nal. Consult Packaging Section of Databook for thermal limita-
tions and considerations of packages.
CONNECTION DIAGRAMS
DESCRIPTION (cont.)
The UCC3912 is designed for unidirectional current flow,
emulating an ideal diode in series with the power switch.
This feature is particularly attractive in applications
where many devices are powering a common bus, such
as with SCSI Termpwr.
The UCC3912 can be put into sleep mode drawing only
1µA of supply current. The SHTDWN pin has a preset
threshold hysteresis which allows the user the ability to
set a time delay upon start-up to achieve sequencing of
power. Other features include an open drain FAULT out-
put indicator, Thermal Shutdown, Under Voltage Lock-
out, and a low thermal resistance Small outline package.
DIL-16, SOIC-16 (Top View)
N, DP Package
TSSOP-24 (Top View)
PWP Package
*Pin 5 serves as lowest impedance to the electrical ground;
Pins 4, 12, and 13 serve as heat sink/ground. These pins
should be connected to large etch areas to help dissipate
heat. For N package, pins 4, 12, and 13 are N/C.
SHTDWN 1
VIN 2
VIN 3
N/C 4
GND* 5
GND* 6
GND* 7
GND* 8
EGND* 9
B3 10
B2 11
B1 12
24 FAULT
23 VOUT
22 VOUT
21 N/C
20 GND*
19 GND*
18 GND*
17 GND*
16 GND*
15 CT
14 IMAX
13 B0
*Pin 9 serves as lowest impedance to the electrical ground;
other GND pins serve as heat sink/ground. These pins
should be connected to large etch areas to help dissipate
heat.
ELECTRICAL CHARACTERISTICS: Unless otherwise stated, these specifications apply for TJ = 0°C to 70°C, VIN = 5V,
IMAX = 0.4V, SHTDWN = 2.4V.
PARAMETER
TEST CONDITIONS
MIN TYP MAX UNITS
Supply Section
Voltage Input Range
3.0
8.0 V
Supply Current
1.0 2.0 mA
Sleep Mode Current
SHTDWN = 0.2V
0.5 5.0 µA
Output Section
Voltage Drop
I_OUT = 1A
I_OUT = 2A
I_OUT = 3A
0.15 0.22 V
0.3 0.45 V
0.45 0.68 V
I_OUT = 1A, VIN = 3V
I_OUT = 2A, VIN = 3V
I_OUT = 3A, VIN = 3V
0.17 0.27 V
0.35 0.56 V
0.5 0.8 V
2