TSC2008_08 Datasheet, PDF (2/37 Pages) Texas Instruments – 1.2V to 3.6V, 12-Bit, Nanopower, 4-Wire Micro TOUCH SCREEN CONTROLLER with SPI™

TSC2008
SBAS406A – JUNE 2008 – REVISED DECEMBER 2008 .................................................................................................................................................. www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION⁽¹⁾
PRODUCT
TSC2008I
TYPICAL
INTEGRAL
LINEARITY
(LSB)
±1.5
TYPICAL
GAIN
ERROR
(LSB)
0.7
NO MISSING
CODES
RESOLUTION
(BITS)
PACKAGE
TYPE
SPECIFIED
PACKAGE TEMPERATURE
DESIGNATOR
RANGE
16-Pin,
4x4
QFN
RGV ⁽²⁾
–40°C to +85°C
11
12-Pin,
3 x 4 Matrix,
1.5 x 2
YZG
–40°C to +85°C
WCSP
PACKAGE
MARKING
TSC2008I
TSC2008I
ORDERING
NUMBER
TRANSPORT
MEDIA,
QUANTITY
TSC2008RGVT
Small Tape
and Reel, 250
TSC2008RGVR
Tape and
Reel, 2500
TSC2008IYZGT
Small Tape
and Reel, 250
TSC2008IYZGR
Tape and
Reel, 3000
(1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet, or see
the TI website at www.ti.com.
(2) RGV (QFN) package available Q1, 2009.
ABSOLUTE MAXIMUM RATINGS⁽¹⁾
Over operating free-air temperature range (unless otherwise noted).
PARAMETER
Voltage
Analog input X+, Y+, AUX to GND
Analog input X–, Y– to GND
Voltage range
VDD to GND
Digital input voltage to GND
Digital output voltage to GND
Power dissipation
QFN package
Thermal impedance, θ_JA
WCSP
Low-K
High-K
Operating free-air temperature range, T_A
Storage temperature range, T_STG
Junction temperature, T_J Max
Lead temperature
IEC contact discharge⁽²⁾
IEC air discharge⁽²⁾
Vapor phase (60 sec)
Infrared (15 sec)
X+, X–, Y+, Y–
X+, X–, Y+, Y–
TSC2008
–0.4 to VDD + 0.1
–0.4 to VDD + 0.1
–0.3 to +5
–0.3 to VDD + 0.3
–0.3 to VDD + 0.3
(T_J Max - T_A)/θ_JA
47
113
62
–40 to +85
–65 to +150
+150
+215
+220
±15
±25
UNIT
V
V
V
V
V
°C/W
°C/W
°C/W
°C
°C
°C
°C
°C
kV
kV
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to
absolute-maximum rated conditions for extended periods may affect device reliability.
(2) Test method based on IEC standard 61000-4-2. Device powered by battery. Contact Texas Instruments for test details.
2
Submit Documentation Feedback
Product Folder Link(s): TSC2008
Copyright © 2008, Texas Instruments Incorporated