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TPS62671_11 Datasheet, PDF (2/34 Pages) Texas Instruments – 500-mA, 6-MHz HIGH-EFFICIENCY STEP-DOWN CONVERTER IN LOW PROFILE CHIP SCALE PACKAGING (HEIGHT
TPS62671, TPS62674, TPS62675, TPS62679
SLVS952B – APRIL 2010 – REVISED JANUARY 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
TA
-40°C to 85°C
PART
NUMBER
TPS62671 (4)
TPS62672 (4)
TPS62674
TPS62675 (4)
TPS62679
ORDERING INFORMATION(1)
OUTPUT
VOLTAGE (2)
DEVICE
SPECIFIC FEATURE
1.8V
1.5V
1.26V
1.2V
1.26V
PWM Spread Spectrum Modulation
PWM Spread Spectrum Modulation
PWM Spread Spectrum Modulation
PWM Operation Only
Output Capacitor Discharge
PWM Spread Spectrum Modulation
PWM Spread Spectrum Modulation
Extended Start-Up Time
Output Capacitor Discharge
ORDERING (3)
TPS62671YFD
TPS62672YFD
TPS62674YFD
TPS62675YFD
TPS62679ZYFM
PACKAGE
MARKING
CHIP CODE
NZ
OA
PN
OB
-
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(2) Internal tap points are available to facilitate output voltages in 25mV increments.
(3) The YFD package is available in tape and reel. Add a R suffix (e.g. TPS62670YFDR) to order quantities of 3000 parts. Add a T suffix
(e.g. TPS62670YFDT) to order quantities of 250 parts.
(4) Product preview. Contact TI factory for more information.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)(1)
Input Voltage
TA
TJ (max)
Tstg
ESD rating (5)
Voltage at VIN(2), SW(3)
Voltage at FB(3)
Voltage at EN, MODE (3)
Power dissipation
Operating temperature range(4)
Maximum operating junction temperature
Storage temperature range
Human body model
Charge device model
Machine model
UNIT
–0.3 V to 6 V
–0.3 V to 3.6 V
–0.3 V to VI + 0.3 V
Internally limited
–40°C to 85°C
150°C
–65°C to 150°C
2 kV
1 kV
200 V
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Operation above 4.8V input voltage for extended periods may affect device reliability.
(3) All voltage values are with respect to network ground terminal.
(4) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (TA(max)) is dependent on the maximum operating junction temperature (TJ(max)), the
maximum power dissipation of the device in the application (PD(max)), and the junction-to-ambient thermal resistance of the part/package
in the application (θJA), as given by the following equation: TA(max)= TJ(max)–(θJA X PD(max)). To achieve optimum performance, it is
recommended to operate the device with a maximum junction temperature of 105°C.
(5) The human body model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin. The machine model is a 200-pF
capacitor discharged directly into each pin.
2
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