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| TPS54873_15 Datasheet, PDF (2/23 Pages) Texas Instruments – 4-V TO 6-V INPUT, 8-A OUTPUT SYNCHRONOUS BUCK SWITCHER WITH DISABLED SINKING DURING START-UP | |||
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TPS54873
SLVS444A â OCTOBER 2002 â REVISED FEBRUARY 2005
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during
storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
TA
â40°C to 85°C
OUTPUT VOLTAGE
0.9 V to 3.3 V
PACKAGE
Plastic HTSSOP (PWP)(1)
PART NUMBER
TPS54873PWP
(1) The PWP package is also available taped and reeled. Add an R suffix to the device type (i.e., TPS54873PWPR). See the application section of
the data sheet for PowerPAD drawing and layout information.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at
www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted(1)
TPS54873
VIN, SS/ENA, SYNC
â0.3 V to 7 V
Input voltage range, VI
RT
VSENSE
â0.3 V to 6 V
â0.3 V to 4V
BOOT
â0.3 V to 17 V
Output voltage range, VO
VBIAS, COMP, PWRGD
PH
â0.3 V to 7 V
â0.6 V to 10 V
Source current, IO
PH
COMP, VBIAS
Internally limited
6 mA
PH
12 A
Sink current, IS
COMP
SS/ENA, PWRGD
6 mA
10 mA
Voltage differential
AGND to PGND
±0.3 V
Operating virtual junction temperature range, TJ
â40°C to 125°C
Storage temperature, Tstg
â65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
300°C
(1) Stresses beyond those listed under âabsolute maximum ratingsâ may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under ârecommended operating conditionsâ is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
MIN NOM MAX UNIT
Input voltage, VI
Operating junction temperature, TJ
4
6V
â40
125 °C
DISSIPATION RATINGS(1)(2)
PACKAGE
28 Pin PWP with solder
THERMAL IMPEDANCE
JUNCTION-TO-AMBIENT
18.2 °C/W
TA = 25°C
POWER RATING
5.49 W(3)
TA = 70°C
POWER RATING
3.02 W
TA = 85°C
POWER RATING
2.20 W
28 Pin PWP without solder
40.5 °C/W
2.48 W
(1) For more information on the PWP package, refer to TI technical brief, literature number SLMA002.
(2) Test board conditions:
1. 3â x 3â, 4 layers, thickness: 0.062â
2. 1.5 oz. copper traces located on the top of the PCB
3. 1.5 oz. copper ground plane on the bottom of the PCB
4. 0.5 oz. copper ground planes on the 2 internal layers
5. 12 thermal vias (see âRecommended Land Patternâ in applications section of this data sheet)
(3) Maximum power dissipation may be limited by over current protection.
1.36 W
0.99 W
2
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