TPS54228_15 Datasheet, PDF (2/30 Pages) Texas Instruments – 4.5V to 18V Input, 2-A Synchronous Step-Down Converter with Eco-mode™

TPS54228
SLVSAU1D – MAY 2011 – REVISED JANUARY 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
T_A
–40°C to 85°C
ORDERING INFORMATION⁽¹⁾
PACKAGE^{(2) (3)}
ORDERABLE PART NUMBER
PIN
DDA
D
DRC
TPS54228DDA
8
TPS54228DDAR
TPS54228D
8
TPS54228DR
TPS54228DRCT
10
TPS54228DRCR
TRANSPORT
MEDIA
Tube
Tape and Reel
Tube
Tape and Reel
Tape and Reel
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) All package options have Cu NIPDAU lead/ball finish.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) ⁽¹⁾
VALUE
MIN
MAX
UNIT
VIN, EN
–0.3
20
VBST
–0.3
26
VBST (10 ns transient)
–0.3
28
Input voltage range
VBST (vs SW)
–0.3
6.5
V
VFB, SS
–0.3
6.5
SW
–2
20
SW (10 ns transient)
–3
22
Output voltage range
VREG5
GND
–0.3
6.5
V
–0.3
0.3
Voltage from GND to thermal pad, V_diff
Electrostatic discharge
Human Body Model (HBM)
Charged Device Model (CDM)
–0.2
0.2
V
2
kV
500
V
Operating junction temperature, T_J
Storage temperature, T_stg
–40
150
°C
–55
150
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
THERMAL INFORMATION
THERMAL METRIC⁽¹⁾
θ_JA
θ_JCtop
θ_JB
ψ_JT
ψ_JB
θ_JCbot
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
DDA (8 PINS)
45.3
54.8
16.2
6.6
16.0
8.5
TPS54228
D (8 PINS)
114.4
60.8
55.7
17.4
55.1
-
DRC (10
PINS)
43.9
55.4
18.9
0.7
19.1
5.3
UNITS
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
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