English
Language : 

TPS5110 Datasheet, PDF (2/18 Pages) Texas Instruments – 3-A SINK/ SOURCE DDR TERMINATION REGULATOR
TPS51100
SLUS600B − APRIL 2004 − REVISED NOVEMBER 2005
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted(1)
TPS51100
UNIT
Input voltage range(2)
Output voltage range(2)
VIN, VLDOIN, VTTSNS, VDDQSNS, S3, S5
PGND
VTT, VTTREF
−0.3 to 6
−0.3 to 0.3
V
−0.3 to 6
Operating ambient temperature range, TA
Storage temperature, Tstg
−40 to 85
°C
−55 to 150
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions”
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to the network ground terminal unless otherwise noted.
DISSIPATION RATING TABLE
PACKAGE
10-pin DGQ
TA < 25°C
POWER RATING
1.73 W
DERATING FACTOR
ABOVE TA = 25°C
17.3 mW/°C
TA = 85°C
POWER RATING
0.694 W
RECOMMENDED OPERATING CONDITIONS
Supply voltage, VIN
Voltage range
Operating free-air temperature, TA
S3, S5
VLDOIN, VDDQSNS, VTT, VTTSNS
VTTREF
PGND
VDDQSNS
VLDOIN
VTT
PGND
VTTSNS
(TOP VIEW)
DGQ Package
1
10
2
9
3
8
4
7
5
6
VIN
S5
GND
S3
VTTREF
MIN
4.75
−0.10
−0.1
−0.1
−0.1
−40
MAX
5.25
5.25
3.6
1.8
0.1
85
UNIT
V
°C
ACTUAL SIZE
3,05mm x 4,98mm
(4) For more information on the DGQ package, refer to TI Technical Brief, Literature No. SLMA002.
(5) PowerPADt heat slug must be connected to GND (pin 8) or electrically isolated from all other pins.
2
www.ti.com