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TPA321_07 Datasheet, PDF (2/26 Pages) Texas Instruments – 350-mW MONO AUDIO POWER AMPLIFIER WITH DIFFERENTIAL INPUTS
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TPA321
SLOS312C – JUNE 2000 – REVISED JUNE 2004
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated
circuits be handled with appropriate precautions. Failure to observe proper handling and installation
procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
TA
–40°C to 85°C
AVAILABLE OPTIONS
PACKAGED DEVICES
SMALL OUTLINE(1) (D)
MSOP(1) (DGN)
TPA321D
TPA321DGN
MSOP
SYMBOLIZATION
AJB
(1) The D and DGN packages are available taped and reeled. To order a taped and reeled part, add the
suffix R to the part number (e.g., TPA321DR).
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)(1)
VDD Supply voltage
VI
Input voltage
Continuous total power dissipation
TA
Operating free-air temperature range
TJ
Operating junction temperature range
Tstg Storage temperature range
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
UNIT
6V
–0.3 V to VDD +0.3 V
Internally limited (see Dissipation Rating Table)
–40°C to 85°C
–40°C to 150°C
–65°C to 150°C
260°C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
PACKAGE
D
DGN
DISSIPATION RATING TABLE
TA ≤ 25°C
725 mW
2.14 W(1)
DERATING FACTOR
5.8 mW/°C
17.1 mW/°C
TA = 70°C
464 mW
1.37 W
TA = 85°C
377 mW
1.11 W
(1) See the Texas Instruments document, PowerPAD Thermally Enhanced Package Application Report
(literature number SLMA002), for more information on the PowerPAD™ package. The thermal data
was measured on a PCB layout based on the information in the section entitled Texas Instruments
Recommended Board for PowerPAD on page 33 of the before mentioned document.
RECOMMENDED OPERATING CONDITIONS
VDD Supply voltage
VIH High-level voltage
SHUTDOWN
VIL
Low-level voltage
SHUTDOWN
TA
Operating free-air temperature
MIN
2.5
0.9 VDD
–40
MAX
5.5
0.1 VDD
85
UNIT
V
V
V
°C
2
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