TPA3111D1 Datasheet, PDF (2/26 Pages) Texas Instruments – 10-W FILTER-FREE MONO CLASS-D AUDIO POWER AMPLIFIER with SPEAKER GUARD™

TPA3111D1
SLOS618 – AUGUST 2009 ................................................................................................................................................................................................ www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
V_CC
Supply voltage
AVCC, PVCC
SD, FAULT,GAIN0, GAIN1
V_I
Interface pin voltage
PLIMIT
INN, INP
Continuous total power dissipation
T_A
Operating free-air temperature range
T_J
Operating junction temperature range⁽²⁾
T_stg
Storage temperature range
R_L
Minimum Load Resistance BTL
Electrostatic discharge
Human body model ⁽³⁾ (all pins)
Charged-device model ⁽⁴⁾ (all pins)
UNIT
–0.3 V to 30 V
–0.3 V to V_CC + 0.3 V
–0.3 V toGVDD + 0.3 V
–0.3 V to 6.3 V
See Dissipation Rating Table
–40°C to 85°C
–40°C to 150°C
–65°C to 150°C
3.2
±2 kV
±500 V
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operations of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The TPA3111D1 incorporates an exposed thermal pad on the underside of the chip. This acts as a heatsink, and it must be connected
to a thermally dissipating plane for proper power dissipation. Failure to do so may result in the device going into thermal protection
shutdown. See TI Technical Briefs SCBA017D and SLUA271 for more information about using the QFN thermal pad. See TI Technical
Briefs SLMA002 for more information about using the HTQFP thermal pad.
(3) In accordance with JEDEC Standard 22, Test Method A114-B.
(4) In accordance with JEDEC Standard 22, Test Method C101-A
TYPICAL DISSIPATION RATINGS
PACKAGE ⁽¹⁾
T_A ≤ 25°C
28 pin TSSOP
(PWP)
4.98 W
DERATING FACTOR
25.1 °C/W
T_A = 85°C
2.59 W
θ_JP
0.72
°C/W
ψ_JT
0.45 °C/W
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
V_CC Supply voltage
PVCC, AVCC
V_IH High-level input voltage
SD, GAIN0, GAIN1
V_IL
Low-level input voltage
SD, GAIN0, GAIN1
V_OL Low-level output voltage
FAULT, R_PULLUP=100kΩ, V_CC=26V
I_IH
High-level input current
SD, GAIN0, GAIN1, V_I = 2, V_CC = 18 V
I_IL
Low-level input current
SD, GAIN0, GAIN1, V_I = 0.8V, V_CC = 18 V
T_A
Operating free-air temperature
MIN
MAX UNIT
8
26 V
2
V
0.8 V
0.8 V
50 µA
5 µA
–40
85 °C
DC CHARACTERISTICS
T_A = 25°C, V_CC = 24 V, R_L = 8 Ω (unless otherwise noted)
PARAMETER
TEST CONDITIONS
| V_OS |
Class-D output offset voltage (measured
differentially)
V_I = 0 V, Gain = 36 dB
I_CC
I_CC(SD)
Quiescent supply current
SD = 2 V, no load, PVcc=21V
Quiescent supply current in shutdown mode SD = 0.8 V, no load, PVcc=21V
MIN TYP MAX UNIT
1.5 15 mV
40
mA
400
µA
2
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