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TLC5947 Datasheet, PDF (2/25 Pages) Texas Instruments – 24-Channel, 12-Bit PWM LED Driver with
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TLC5947
SBVS114 – JULY 2008....................................................................................................................................................................................................... www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION(1)
PRODUCT
TLC5947
TLC5947 (2)
PACKAGE-LEAD
HTSSOP-32 PowerPAD™
5-mm × 5-mm QFN-32
ORDERING NUMBER
TLC5947DAPR
TLC5947DAP
TLC5947RHBR
TLC5947RHB
TRANSPORT MEDIA, QUANTITY
Tape and Reel, 2000
Tube, 46
Tape and Reel, 3000
Tape and Reel, 250
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Shaded cells indicate product preview device.
ABSOLUTE MAXIMUM RATINGS(1)(2)
Over operating free-air temperature range, unless otherwise noted.
VCC
IO
VI
VO
TJ(MAX)
TSTG
PARAMETER
Supply voltage: VCC
Output current (dc)
OUT0 to OUT23
Input voltage range
SIN, SCLK, XLAT, BLANK
Output voltage range
SOUT
OUT0 to OUT23
Operating junction temperature
Storage temperature range
ESD rating
Human body model (HBM)
Charged device model (CDM)
TLC5947
–0.3 to +6.0
38
–0.3 to VCC + 0.3
–0.3 to VCC + 0.3
–0.3 to +33
+150
–55 to +150
2
500
UNIT
V
mA
V
V
V
°C
°C
kV
V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not supported.
(2) All voltage values are with respect to network ground terminal.
DISSIPATION RATINGS
PACKAGE
HTSSOP-32 with
PowerPAD soldered(1)
HTSSOP-32 with
PowerPAD not soldered(2)
QFN-32 (3)
OPERATING FACTOR
ABOVE TA = +25°C
42.54 mW/°C
22.56 mW/°C
27.86 mW/°C
TA < +25°C
POWER RATING
5318 mW
2820 mW
3482 mW
TA = +70°C
POWER RATING
3403 mW
1805 mW
2228 mW
TA = +85°C
POWER RATING
2765 mW
1466 mW
1811 mW
(1) With PowerPAD soldered onto copper area on printed circuit board (PCB); 2 oz. copper. For more information, see SLMA002 (available
for download at www.ti.com).
(2) With PowerPAD not soldered onto copper area on PCB.
(3) The package thermal impedance is calculated in accordance with JESD51-5.
2
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