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TLC5946 Datasheet, PDF (2/35 Pages) Texas Instruments – 16-Channel, 12-Bit PWM LED Driver with 6-Bit Dot Correction
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TLC5946
SLVS824A – MARCH 2008 – REVISED APRIL 2008 ......................................................................................................................................................... www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION(1)
PRODUCT
TLC5946
TLC5946
TLC5946
PACKAGE-LEAD
TSSOP-28
HTSSOP-28 PowerPAD™
5 mm × 5 mm QFN-32
ORDERING NUMBER
TLC5946PW
TLC5946PWP
TLC5946RHB (2)
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Shaded cells indicate product preview device.
ABSOLUTE MAXIMUM RATINGS(1)(2)
Over operating free-air temperature range, unless otherwise noted.
VCC
IOUT
VIN
VOUT
TJ(ABS)
TSTG
PARAMETER
Supply voltage: VCC
Output current (dc)
OUT0 to OUT15
XERR
Input voltage range: SIN, SCLK, GSCLK, XLAT, BLANK, MODE, XHALF,
IREF
Output voltage range
SOUT, XERR
OUT0 to OUT15
Operating temperature range: junction temperature
Storage temperature range
ESD rating
Human body model (HBM),
JEDEC JESD22-A114
Charged device model (CDM),
JEDEC JESD22-C101
TLC5946
–0.3 to +6.0
50
6
–0.3 to VCC + 0.3
–0.3 to VCC + 0.3
–0.3 to +18
–40 to +150
–55 to +150
2
500
UNIT
V
mA
mA
V
V
V
°C
°C
kV
V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not supported.
(2) All voltage values are with respect to network ground terminal.
DISSIPATION RATINGS
PACKAGE
TSSOP-28
HTSSOP-28 with
PowerPAD soldered(1)
HTSSOP-28 with
PowerPAD not soldered(2)
QFN-32 (3)
OPERATING FACTOR
ABOVE TA = +25°C
16.21 mW/°C
31.67 mW/°C
16.21 mW/°C
27.86 mW/°C
TA < +25°C
POWER RATING
2026 mW
3958 mW
2026 mW
3482 mW
TA = +70°C
POWER RATING
1296 mW
2533 mW
1296 mW
2228 mW
TA = +85°C
POWER RATING
1053 mW
2058 mW
1053 mW
1811 mW
(1) With PowerPAD soldered onto copper area on printed circuit board (PCB); 2 oz. copper. For more information, see SLMA002 (available
for download at www.ti.com).
(2) With PowerPAD not soldered onto copper area on PCB.
(3) The package thermal impedance is calculated in accordance with JESD51-5.
2
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