TLC5928_1 Datasheet, PDF (2/28 Pages) Texas Instruments – 16-Channel, Constant-Current LED Driver with LED Open Detection

TLC5928
SBVS120B – JULY 2008 – REVISED OCTOBER 2008...................................................................................................................................................... www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION⁽¹⁾
PRODUCT
TLC5928
TLC5928
TLC5928
TLC5928
PACKAGE-LEAD
SO-24
TSSOP-24
HTSSOP-24 PowerPAD™
QFN-24
ORDERING NUMBER
TLC5928DBQR
TLC5928DBQ
TLC5928PWR
TLC5928PW
TLC5928PWPR
TLC5928PWP
TLC5928RGER
TLC5928RGE
TRANSPORT MEDIA, QUANTITY
Tape and Reel, 2500
Tube, 50
Tape and Reel, 2000
Tube, 60
Tape and Reel, 2000
Tube, 60
Tape and Reel, 3000
Tape and Reel, 250
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS⁽¹⁾⁽²⁾
Over operating free-air temperature range, unless otherwise noted.
V_CC
I_OUT
V_IN
V_OUT
T_J(MAX)
T_STG
PARAMETER
Supply voltage: V_CC
Output current (dc)
OUT0 to OUT15
Input voltage range
SIN, SCLK, LAT, BLANK, IREF
Output voltage range
SOUT
OUT0 to OUT15
Operating junction temperature
Storage temperature range
ESD rating
Human body model (HBM)
Charged device model (CDM)
TLC5928
–0.3 to +6.0
40
–0.3 to V_CC + 0.3
–0.3 to V_CC + 0.3
–0.3 to +18
+150
–55 to +150
2
500
UNIT
V
mA
V
V
V
°C
°C
kV
V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not supported.
(2) All voltage values are with respect to network ground terminal.
DISSIPATION RATINGS
PACKAGE
SO-24
TSSOP-24
HTSSOP-24 ⁽¹⁾
QFN-24 ⁽²⁾
OPERATING FACTOR
ABOVE T_A = +25°C
14.3 mW/°C
9.6 mW/°C
28.9 mW/°C
24.8 mW/°C
T_A < +25°C
POWER RATING
1782 mW
1194 mW
3611 mW
3106 mW
T_A = +70°C
POWER RATING
1140 mW
764 mW
2311 mW
1988 mW
T_A = +85°C
POWER RATING
927 mW
621 mW
1878 mW
1615 mW
(1) With PowerPAD soldered onto copper area on printed circuit board (PCB); 2 oz. copper. For more information, see SLMA002 (available
for download at www.ti.com).
(2) The package thermal impedance is calculated in accordance with JESD51-5.
2
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