TLC59284 Datasheet, PDF (2/23 Pages) Texas Instruments – 16-Channel, Constant-Current LED Driver with Switching Delay

TLC59284
SBVS208A – OCTOBER 2012 – REVISED OCTOBER 2012
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PRODUCT
TLC59284
PACKAGE AND ORDERING INFORMATION⁽¹⁾
PACKAGE-LEAD
ORDERING NUMBER
TRANSPORT MEDIA, QUANTITY
SSOP-24, QSOP-24
TLC59284DBQR
TLC59284DBQ
Tape and Reel, 2500
Tube, 50
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
ABSOLUTE MAXIMUM RATINGS⁽¹⁾⁽²⁾
Over operating free-air temperature range, unless otherwise noted.
Supply voltage
Input voltage range, V_IN
Output voltage range, V_OUT
Current, I_OUT
Temperature
Electrostatic discharge (ESD) ratings
V_CC
SIN, SCLK, LAT, BLANK, IREF
Output range, SOUT
Output range, OUT0 to OUT15
Output (dc), OUT0 to OUT15
Operating junction, T_J(MAX)
Storage range, T_stg
Human body model (HBM)
Charged device model (CDM)
VALUE
MIN
MAX
–0.3
+6
–0.3
–0.3
–0.3
V_CC + 0.3
V_CC + 0.3
+11
+50
+150
–55
+150
4000
2000
UNIT
V
V
V
V
mA
°C
°C
V
V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not supported.
(2) All voltage values are with respect to network ground terminal.
THERMAL INFORMATION
THERMAL METRIC⁽¹⁾
θ_JA
θ_JCtop
θ_JB
ψ_JT
ψ_JB
θ_JCbot
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
TLC59284
DBQ
24 PINS
91.5
55.2
44.9
16.8
44.5
N/A
UNITS
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
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