TLC2801Z Datasheet, PDF (2/13 Pages) Texas Instruments – Advanced LinCMOSE™ LOW-NOISE PRECISION OPERATIONAL AMPLIFIERS

TLC2801Z, TLC2801Y
Advanced LinCMOS™ LOW-NOISE PRECISION
OPERATIONAL AMPLIFIERS
SLOS116B – JULY 1982 – REVISED SEPTEMBER 1996
AVAILABLE OPTIONS
TA
VIOmax
AT 150°C
PACKAGED DEVICES
SMALL OUTLINE
(D)
PLASTIC DIP
(P)
CHIP
FORM
(Y)
– 40°C to 150°C
1.5 mV
TLC2801ZD
TLC2801ZP
TLC2801Y
The D packages are available taped and reeled. Add R suffix to the device type when ordering
(e.g., TLC2801ZDR).
TLC2801Y chip information
This chip, properly assembled, displays characteristics similar to the TLC2801. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(7)
(6)
VCC+
(7)
(2)
IN –
+
(6)
IN + ⁽³⁾ _–
OUT
(4)
VCC _– / GND
80
(2)
(3)
90
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
TJmax= 150°C
TOLERANCES ARE ± 10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
(4)
3–2
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