TL783C_07 Datasheet, PDF (2/15 Pages) Texas Instruments – HIGH-VOLTAGE ADJUSTABLE REGULATOR

TL783C, TL783Y
HIGH-VOLTAGE ADJUSTABLE REGULATOR
SLVS036C – SEPTEMBER 1981 – REVISED APRIL 1997
TL783Y chip information
This chip, when properly assembled, displays characteristics similar to those of the TL783C. Thermal
compression or ultrasonic bonding may be used on the doped aluminum bonding pads. The chip may be
mounted with conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(2)
(1)
(3)
IN
TL783Y
(2), (4)
OUT
(1)
ADJ
(3)
102
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
TJmax = 150°C
TOLERANCES ARE ± 10%
ALL DIMENSIONS ARE IN MILS
OUTPUT TERMINAL MUST BE
BONDED TO BOTH 2 AND 4
(4)
74
2
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