TL780_15 Datasheet, PDF (2/17 Pages) Texas Instruments – POSITIVE-VOLTAGE REGULATORS

TL780 SERIES
POSITIVE-VOLTAGE REGULATORS
SLVS055M – APRIL 1981 – REVISED OCTOBER 2006
SCHEMATIC
www.ti.com
INPUT
OUTPUT
COMMON
Absolute Maximum Ratings⁽¹⁾
over operating temperature ranges (unless otherwise noted)
V_I
Input voltage
T_J
Operating virtual junction temperature
Lead temperature 1,6 mm (1/16 in) from case for 10 s
T_stg Storage temperature range
MIN
MAX UNIT
35
V
150
°C
260
°C
–65
150
°C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Package Thermal Data⁽¹⁾
PACKAGE
PowerFLEX (KTE)
TO-220 (KC/KCS)
TO-263 (KTT)
BOARD
High K, JESD 51-5
High K, JESD 51-5
High K, JESD 51-5
θ_JP ⁽²⁾
2.7°C/W
3°C/W
1.91°C/W
θ_JC
11.6°C/W
17°C/W
18°C/W
θ_JA
23.3°C/W
19°C/W
25.3°C/W
(1) Maximum power dissipation is a function of T_J(max), θ_JA, and T_A. The maximum allowable power dissipation at any allowable ambient
temperature is P_D = (T_J(max) – T_A)/θ_JA. Operating at the absolute maximum T_J of 150°C can affect reliability. Due to variations in
individual device electrical characteristics and thermal resistance, the built-in thermal overload protection may be activated at power
levels slightly above or below the rated dissipation.
(2) For packages with exposed thermal pads, such as QFN, PowerPAD™, or PowerFLEX, θ_JP is defined as the thermal resistance between
the die junction and the bottom of the exposed pad.
2
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