TL3016 Datasheet, PDF (2/12 Pages) Texas Instruments – ULTRA-FAST LOW-POWER PRECISION COMPARATORS

TL3016, TL3016Y
ULTRA-FAST LOW-POWER
PRECISION COMPARATORS
SLCS130D – MARCH 1997 – REVISED MARCH 2000
TL3016Y chip information
This chip displays characteristics similar to the TL3016C. Thermal compression or ultrasonic bonding may be
used on the doped-aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon
preform.
BONDING PAD ASSIGNMENTS
(1)
(1)
(2)
55
(3)
(4)
(1)
(8)
(7)
(6)
(6)
(5)
(6)
63
(5)
LATCH ENABLE
VCC+
(1)
(2)
IN+
+
(3)
IN–
–
(8)
Q OUT
(7) ^{Q OUT}
(4)
VCC _– ⁽⁶⁾
GND
CHIP THICKNESS: 10 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
TJ max = 150°C
TOLERANCES ARE ± 10%.
ALL DIMENSIONS ARE IN MILS.
TERMINALS 1 AND 6 CAN BE
CONNECTED TO MULTIPLE PADS.
COMPONENT COUNT
Bipolars
53
MOSFETs
49
Resistors
46
Capacitors
14
2
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