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THS7375 Datasheet, PDF (2/36 Pages) Texas Instruments – 4-Channel SDTV Video Amplifier with 6th-Order Filters and 5.6-V/V Gain
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THS7375
SBOS449 – SEPTEMBER 2008......................................................................................................................................................................................... www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PRODUCT
THS7375IPW
THS7375IPWR
PACKAGE/ORDERING INFORMATION(1)
PACKAGE-LEAD
TSSOP-14
TRANSPORT MEDIA, QUANTITY
Rails, 90
Tape and Reel, 2000
ECO STATUS(2)
Pb-Free, Green
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) These packages conform to Lead (Pb)-free and green manufacturing specifications. Additional details including specific material
contentcan be accessed at www.ti.com/leadfree.
GREEN: TI defines Green to mean Lead (Pb)-Free and in addition, uses less package materials that do not contain halogens, including
bromine (Br), or antimony (Sb) above 0.1% of total product weight. N/A: Not yet available Lead (Pb)-Free; for estimated conversion
dates, go to www.ti.com/leadfree. Pb-FREE: TI defines Lead (Pb)-Free to mean RoHS compatible, including a lead concentration that
does not exceed 0.1% of total product weight, and, if designed to be soldered, suitable for use in specified lead-free soldering
processes.
ABSOLUTE MAXIMUM RATINGS(1)
Over operating free-air temperature range unless otherwise noted.
Supply voltage, VS+ to GND
Input voltage, VI
Output current, IO
Continuous power dissipation
Maximum junction temperature, any condition(2) TJ
Maximum junction temperature, continuous operation, long-term reliability(3), TJ
Storage temperature range, TSTG
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
Human body model (HBM)
ESD ratings
Charged device model (CDM)
Machine model
THS7375
UNIT
5.5
V
–0.4 to VS+
V
±90
mA
See Dissipation Ratings Table
+150
°C
+125
°C
–65 to +150
°C
+300
°C
2000
V
1000
V
200
V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
(2) The absolute maximum junction temperature under any condition is limited by the constraints of the silicon process.
(3) The absolute maximum junction temperature for continuous operation is limited by the package constraints. Operation above this
temperature may result in reduced reliability and/or lifetime of the device.
DISSIPATION RATINGS
PACKAGE
TSSOP-14 (PW)
θJC
(°C/W)
35
θJA
(°C/W)
115 (2)
AT TA ≤ +25°C
POWER RATING(1)
870 mW
AT TA = +85°C
POWER RATING(1)
348 mW
(1) Power rating is determined with a junction temperature of +125°C. This is the point where performance starts to degrade and long-term
reliability starts to be reduced. Thermal management of the final PCB should strive to keep the junction temperature at or below +125°C
for best performance and reliability.
(2) These data were taken with the JEDEC High-K test printed circuit board (PCB). For the JEDEC low-K test PCB, the θJA is +185°C.
RECOMMENDED OPERATING CONDITIONS
Supply voltage, VS+
Ambient temperature, TA
MIN
NOM
MAX
UNIT
3
5
V
–40
+85
°C
2
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