THS6226_15 Datasheet, PDF (2/21 Pages) Texas Instruments – Gated-Class H, Dual-Port VDSL2 Line Driver

THS6226
SBOS499C – JANUARY 2011 – REVISED APRIL 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PRODUCT ⁽²⁾
THS6226IRHBT
THS6226IRHBR
PACKAGE-LEAD
VQFN-32
ORDERING INFORMATION⁽¹⁾
PACKAGE
DESIGNATOR
PACKAGE MARKING
RHB
THS6226IRHB
TRANSPORT MEDIA, QUANTITY
Tape and Reel, 250
Tape and Reel, 3000
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
(2) The PowerPAD is electrically isolated from all other pins.
ABSOLUTE MAXIMUM RATINGS⁽¹⁾
Over operating free-air temperature range, unless otherwise noted.
PARAMETER
Supply voltage, GND to V_S+, class AB only
Supply voltage, GND to V_S+, class H only
Input voltage, V_I
Output current, I_O: static dc⁽²⁾
Continuous power dissipation
Normal storage temperature
Maximum junction temperature, any condition, T_J(3)
Maximum junction temperature, continuous operation, long-term reliability, T_J(4)
Storage temperature range, T_STG
ESD
ratings:
Human body model (HBM)
Charged device model (CDM)
Machine model (MM)
THS6226
UNIT
15
V
12.5
V
15
V
±100
mA
See Thermal Information table
–40 to +85
°C
+150
°C
+130
°C
–65 to +150
°C
2000
V
500
V
100
V
(1) Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute maximum rated conditions for extended periods may degrade device reliability.
(2) The THS6226 incorporates a PowerPAD on the underside of the chip. This acts as a heatsink and must be connected to a thermally
dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature which could
permanently damage the device. See TI Technical Brief SLMA002 for more information about utilizing the PowerPAD
thermally-enhanced package. Under high-frequency ac operation (> 10kHz), the short-term output current capability is much greater
than the continuous dc output current rating. This short-term output current rating is about 8.5x the dc capability, or approximately
±850mA.
(3) The absolute maximum junction temperature under any condition is limited by the constraints of the silicon process.
(4) The absolute maximum junction temperature for continuous operation is limited by the package constraints. Operation above this
temperature may result in reduced reliability and/or lifetime of the device.
THERMAL INFORMATION
θ_JA
θ_JCtop
θ_JB
ψ_JT
ψ_JB
θ_JCbot
THERMAL METRIC⁽¹⁾
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
THS6226
RHB
32 PINS
35.1
22.1
7.0
0.3
6.9
1.3
UNITS
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
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