THS6184 Datasheet, PDF (2/4 Pages) Texas Instruments – DUAL-PORT, LOW-POWER DIFFERENTIAL xDSL LINE DRIVER AMPLIFIERS

THS6184
SLLS635 – JANUARY 2005
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated
circuits be handled with appropriate precautions. Failure to observe proper handling and installation
procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
PACKAGED DEVICES⁽²⁾
THS6184RHFT
THS6184RHFR
PACKAGING/ORDERING INFORMATION⁽¹⁾
DEVICE MARKING
PACKAGE TYPE
6184
Leadless MSOP
TRANSPORT MEDIA, QUANTITY
Tape and Reel, 250
Tape and Reel, 3000
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(2) The PowerPAD is electrically Isolated from all other pins.
PIN CONFIGURATION
TOP VIEW
RHF
D1 IN+
D2 IN+
GND
IADJ
NC
D3 IN+
D4 IN+
24 23 22 21 20
1
19
2
18
3 _{Power 17}
4
PAD^TM 16
5
15
6
14
7
8
9 10 11 1213
D1 IN−
D2 IN−
D2 OUT
D3 OUT
D3 IN−
D4 IN−
D4 OUT
NC − No internal connection
See Notes A, B, and C
A. The THS6184 defaults to the FULL BIAS state if no signal is present on the BIAS pins.
B. The PowerPAD is electrically isolated from all other pins and can be connected to any potential voltage range from
V_s– to V_s+. Typically, the PowerPAD is connected to the GND plane as this plane tends to be physically the largest
and able to dissipate the most amount of heat.
C. The GND pin range is from Vs- to (Vs+ – 2.5 V).
Please contact Texas Instruments for full data sheet.
2