THS6042 Datasheet, PDF (2/33 Pages) Texas Instruments – 350 mA, ±12 V ADSL CPE LINE DRIVERS

THS6042, THS6043
350 mA, ±12 V ADSL CPE LINE DRIVERS
SLOS264G – MARCH 2000 – REVISED DECEMBER 2001
AVAILABLE OPTIONS
PACKAGED DEVICE
TA
SOIC-8
SOIC-8 PowerPAD
SOIC-14
(D)
(DDA)
(D)
0°C to 70°C
THS6042CD
THS6042CDDA
THS6043CD
– 40°C to 85°C
THS6042ID
THS6042IDDA
THS6043ID
TSSOP-14
(PWP)
THS6043CPWP
THS6043IPWP
EVALUATION
MODULES
THS6042EVM
THS6043EVM
—
absolute maximum ratings over operating free-air temperature (unless otherwise noted)^†
Supply voltage, V_CC+ to V_CC– . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 V
Input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± V_CC
Output current (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 450 mA
Differential input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 4 V
Maximum junction temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Total power dissipation at (or below) 25°C free-air temperature . . . . . . . . . . . See Dissipation Ratings Table
Operating free-air temperature, T_A: Commercial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 40°C to 85°C
Storage temperature, T_stg : Commercial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 125°C
Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 125°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C
† _{Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and}
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The THS6042 and THS6043 may incorporate a PowerPAD on the underside of the chip. This acts as a heatsink and must be connected
to a thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature
which could permanently damage the device. See TI Technical Brief SLMA002 for more information about utilizing the PowerPAD
thermally enhanced package.
DISSIPATION RATING TABLE
PACKAGE
θ_JA
TA = 25°C
θ_JC
TJ = 150°C
POWER RATING
D-8
95°C/W^‡
38.3°C/W^‡
1.32 W
DDA
45.8°C/W^‡
9.2°C/W^‡
2.73 W
D-14
66.6°C/W^‡
26.9°C/W^‡
1.88 W
PWP
37.5°C/W
1.4°C/W
3.3 W
‡ _{This data was taken using the JEDEC proposed high-K test PCB. For the JEDEC low-K test}
PCB, the Θ_JA is168°C/W for the D–8 package and 122.3°C/W for the D–14 package.
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