THS4532 Datasheet, PDF (2/44 Pages) Texas Instruments – Ultra Low Power, Rail-to-Rail Output, Fully-Differential Amplifier

THS4532
SLOS829 – FEBRUARY 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PRODUCT
THS4532
CHANNEL
COUNT
2
2
PACKAGING/ORDERING INFORMATION⁽¹⁾
PACKAGE-
LEAD
PACKAGE
DESIGNATOR
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
THS4532
TSSOP-16
PW
–40°C to +125°C
THS4532
ORDERING
NUMBER
THS4532IPWT
THS4532IPWR
TRANSPORT
MEDIA,
QUANTITY
Rails, 90
Tape and reel, 2000
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
Supply voltage, V_S– to V_S+
Input/output voltage, V_IN±, V_OUT±, and V_OCM pins
Differential input voltage, V_ID
Continuous output current, I_O
Continuous input current, I_i
Continuous power dissipation
Maximum junction temperature, T_J
Operating free-air temperature range, T_A
Storage temperature range, T_stg
Electrostatic
Human body model (HBM)
discharge (ESD)
ratings:
Charge device model (CDM)
VALUE
MIN
MAX
5.5
(V_S–) – 0.7
(V_S+) + 0.7
1
50
0.75
See the Thermal Information
150
–40
+125
–65
+150
2.5
500
UNITS
V
V
V
mA
mA
°C
°C
°C
kV
V
THERMAL INFORMATION
THERMAL METRIC ⁽¹⁾
TSSOP
(PW)
16 PINS
UNITS
θ_JA
θ_JCtop
θ_JB
ψ_JT
ψ_JB
θ_JCbot
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
122.4
61.2
66.7
14.4
66.2
N/A
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
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