THS4304 Datasheet, PDF (2/26 Pages) Texas Instruments – Wideband Operational Amplifier

THS4304
SLOS436A – MARCH 2004 – REVISED JULY 2004
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
TOP VIEW
PINOUT DRAWING
DBV
TOP VIEW
D and DGK
V_OUT
1
V_S−
2
IN+
3
5
V_{S+ NC}
1
IN−
2
IN+
3
4
IN−
V_S−
4
8
NC
7
V_S+
6
V_OUT
5
V_OUT
NOTE: NC indicates there is no internal connection to these pins.
PACKAGED DEVICES
THS4304DBVT
THS4304DBVR
THS4304D
THS4304DR
THS4304DGK
THS4304DGKR
PACKAGING / ORDERING INFORMATION
PACKAGE TYPE
PACKAGE MARKINGS
SOT-23-5
AKW
SOIC-8
—
MSOP-8
AKU
TRANSPORT MEDIA,
QUANTITY
Tape and Reel, 250
Tape and Reel, 3000
Rails, 75
Tape and Reel, 2500
Rails, 100
Tape and Reel, 2500
DISSIPATION RATINGS
PACKAGE
DBV (5)
D (8)
DGK (8)
θ_JC
(°C/W)
55
38.3
71.5
θ_JA
(°C/W) ⁽¹⁾
255.4
97.5
180.8
POWER RATING⁽²⁾
T_A≤ 25°C
391 mW
T_A = 85°C
156 mW
1.02 W
410 mW
553 mW
221 mW
(1) This data was taken using the JEDEC standard High-K test PCB.
(2) Power rating determined with a junction temperature of 125°C. This is the point where distortion starts to substantially increase. Thermal
management of the final PCB should strive to keep the junction temperature at or below 125°C for best performance and long-term
reliability.
2