THS4150 Datasheet, PDF (2/27 Pages) Texas Instruments – HIGH-SPEED DIFFERENTIAL I/O AMPLIFIERS

THS4150, THS4151
HIGHĆSPEED DIFFERENTIAL I/O AMPLIFIERS
SLOS321D − MAY 2000 − REVISED JANUARY 2004
TA
0°C to 70°C
−40°C to 85°C
SMALL OUTLINE
(D)
THS4150CD
THS4151CD
THS4150ID
THS4151ID
AVAILABLE OPTIONS
PACKAGED DEVICES
MSOP PowerPAD
(DGN)
SYMBOL
THS4150CDGN
AQB
THS4151CDGN
AQD
THS4150IDGN
AQC
THS4151IDGN
AQE
MSOP
(DGK)
THS4150CDGK
THS4151CDGK
THS4150IDGK
THS4151IDGK
SYMBOL
ATT
ATU
AST
ASU
EVALUATION
MODULES
THS4150EVM
THS4151EVM
−
−
absolute maximum ratings over operating free–air temperature range (unless otherwise noted)^†
Supply voltage, V_CC− to V_CC+ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±16.5 V
Input voltage, V_I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±V_CC
Output current, I_O (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150 mA
Differential input voltage, V_ID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±6 V
Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table
Maximum junction temperature, T_J (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Maximum junction temperature, continuous operation, long term reliability, T_J (see Note 3) . . . . . . . . 125°C
Operating free-air temperature, T_A:C suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
I suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C
Storage temperature, T_stg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
Lead temperature 1,6 mm (1/16 Inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C
ESD ratings:
HBM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2500 V
CDM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1500 V
MM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 V
† _{Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and}
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The THS415x may incorporate a PowerPad on the underside of the chip. This acts as a heatsink and must be connected to a thermally
dissipative plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature which could
permanently damage the device. See TI technical brief SLMA002 and SLMA004 for more information about utilizing the PowerPad
thermally enhanced package.
NOTE 2: The absolute maximum temperature under any condition is limited by the constraints of the silicon process.
NOTE 3: The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may
result in reduced reliability and/or lifetime of the device.
PACKAGE
D
DISSIPATION RATING TABLE
θ_JA ^‡
(°C/W)
θ_JC
(°C/W)
97.5
38.3
POWER RATING^§
TA = 25°C
1.02 W
TA = 85°C
410 mW
DGN
58.4
4.7
1.71 W
685 mW
DGK
260
54.2
385 mW
154 mW
‡ _{This data was taken using the JEDEC standard High−K test PCB.}
§ _{Power rating is determined with a junction temperature of 125°C. This is the point where distortion starts to}
substantially increase. Thermal management of the final PCB should strive to keep the junction temperature at or
below 125°C for best performance and long term reliability.
recommended operating conditions
Supply voltage, VCC+ to VCC−
Operating free-air temperature, T_A
Dual supply
Single supply
C suffix
I suffix
MIN TYP
± 2.5
5
0
−40
MAX
±15
30
70
85
UNIT
V
°C
PowerPAD is a trademark of Texas Instruments.
2
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