THS4130 Datasheet, PDF (2/27 Pages) Texas Instruments – HIGH SPEED LOW NOISE, FULLY DIFFERENTIAL I/O AMPLIFIERS

THS4130, THS4131
HIGHĆSPEED, LOW NOISE, FULLYĆDIFFERENTIAL I/O AMPLIFIERS
SLOS318E − MAY 2000 − REVISED JANUARY 2004
TA
0°C to 70°C
−40°C to 85°C
SMALL OUTLINE
(D)
THS4130CD
THS4131CD
THS4130ID
THS4131ID
AVAILABLE OPTIONS
PACKAGED DEVICES
MSOP PowerPAD
(DGN)
SYMBOL
THS4130CDGN
AOB
THS4131CDGN
AOD
THS4130IDGN
AOC
THS4131IDGN
AOE
MSOP
(DGK)
THS4130CDGK
THS4131CDGK
THS4130IDGK
THS4131IDGK
SYMBOL
ATP
ATQ
ASO
ASP
EVALUATION
MODULES
THS4130EVM
THS4131EVM
−
−
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)^†
Supply voltage, V_CC− to V_CC+ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 33 V
Input voltage, V_I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± V_CC
Output current, I_O (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150 mA
Differential input voltage, V_ID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 6 V
Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table
Maximum junction temperature, T_J (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Maximum junction temperature, continuous operation, long term reliability, T_J (see Note 3) . . . . . . . . 125°C
Operating free-air temperature, T_A:C suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
I suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C
Storage temperature, T_stg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
Lead temperature 1,6 mm (1/16 Inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C
ESD ratings:
HBM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2500 V
CDM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1500 V
MM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 V
† _{Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and}
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The THS413x may incorporate a PowerPad on the underside of the chip. This acts as a heatsink and must be connected to a thermally
dissipative plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature which could
permanently damage the device. See TI technical brief SLMA002 and SLMA004 for more information about utilizing the PowerPad
thermally enhanced package.
NOTE 2: The absolute maximum temperature under any condition is limited by the constraints of the silicon process.
NOTE 3: The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may
result in reduced reliability and/or lifetime of the device.
PACKAGE
D
DISSIPATION RATING TABLE
θ_JA ^‡
(°C/W)
θ_JC
(°C/W)
97.5
38.3
POWER RATING^§
TA = 25°C
1.02 W
TA = 85°C
410 mW
DGN
58.4
4.7
1.71 W
685 mW
DGK
260
54.2
385 mW
154 mW
‡ _{This data was taken using the JEDEC standard High−K test PCB.}
§ _{Power rating is determined with a junction temperature of 125°C. This is the point where distortion starts to}
substantially increase. Thermal management of the final PCB should strive to keep the junction temperature at or
below 125°C for best performance and long term reliability.
recommended operating conditions
Supply voltage, VCC+ to VCC−
Operating free-air temperature, T_A
Dual supply
Single supply
C suffix
I suffix
MIN TYP
± 2.5
5
0
− 40
MAX
± 15
30
70
85
UNIT
V
°C
PowerPAD is a trademark of Texas Instruments.
2
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