THS3110 Datasheet, PDF (2/28 Pages) Texas Instruments – LOW-NOISE, HIGH-VOLTAGE, CURRENT-FEEDBACK, OPERATIONAL AMPLIFIERS

THS3110, THS3111
SLOS422A – SEPTEMBER 2003 – REVISED NOVEMBER 2003
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling procedures and installation procedures can cause damage.
TOP VIEW
D, DGN
TOP VIEW
D, DGN
REF
V_IN−
V_IN+
V_S−
THS3110
1
8
2
7
3
6
4
5
PD
V_S+
V_OUT
NC
NC
V_{IN −}
V_{IN +}
V_S−
THS3111
1
8
2
7
3
6
4
5
NC
V_S+
V_OUT
NC
NC = No Internal Connection
NC = No Internal Connection
Note: The device with the power down option defaults to the ON state if no signal is applied to the PD pin. Additionallly, the REF pin
functional range is from V_S− to (V_S+ − 4 V).
AVAILABLE OPTIONS
T_A
0°C to 70°C
-40°C to 85°C
0°C to 70°C
-40°C to 85°C
PLASTIC SMALL OUTLINE SOIC (D)
THS3110CD
THS3110CDR
THS3110ID
THS3110IDR
THS3111CD
THS3111CDR
THS3111ID
THS3111IDR
PACKAGED DEVICE
PLASTIC MSOP (DGN)⁽¹⁾⁽²⁾
THS3110CDGN
THS3110CDGNR
THS3110IDGN
THS3110IDGNR
THS3111CDGN
THS3111CDGNR
THS3111IDGN
THS3111IDGNR
(1) Available in tape and reel. The R suffix standard quantity is 2500 (e.g. THS3110CDGNR).
(2) The PowerPAD is electrically isolated from all other pins.
SYMBOL
BJB
BIR
BJA
BIS
DISSIPATION RATING TABLE
PACKAGE
D-8 ⁽¹⁾
DGN-8 ⁽²⁾
Θ_JC (°C/W)
38.3
4.7
Θ_JA (°C/W)
95
58.4
T_A = 25°C
1.05 W
1.71 W
POWER RATING
T_J = 125°C
T_A = 85°C
421 mW
685 mW
(1) This data was taken using the JEDEC standard low-K test PCB. For the JEDEC proposed high-K test PCB, the Θ_JA is 95°C/W with
power rating at T_A = 25°C of 1.05 W.
(2) This data was taken using 2 oz. trace and copper pad that is soldered directly to a 3 inch x 3 inch PCB. For further information, refer to
the Application Informationsection of this data sheet.
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