SN74LVC07A-Q1 Datasheet, PDF (2/9 Pages) Texas Instruments – HEX BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS

SN74LVC07A-Q1
HEX BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUTS
SCAS783C – OCTOBER 2004 – REVISED DECEMBER 2007
www.ti.com
Absolute Maximum Ratings⁽¹⁾
over operating free-air temperature range (unless otherwise noted)
V_CC Supply voltage range
V_I
Input voltage range⁽²⁾
V_O
Output voltage range
I_IK
Input clamp current
I_OK
Output clamp current
I_O
Continuous output current
Continuous current through V_CC or GND
θ_JA
Package thermal impedance⁽³⁾
T_stg Storage temperature range
V_I < 0
V_O < 0
D package
PW package
MIN MAX UNIT
–0.5 6.5 V
–0.5 6.5 V
–0.5 6.5 V
–50 mA
–50 mA
±50 mA
±100 mA
86
°C/W
113
–65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions⁽¹⁾
V_CC Supply voltage
V_IH High-level input voltage
V_IL
Low-level input voltage
V_I
Input voltage
V_O
Output voltage
I_OL
Low-level output current
T_A
Operating free-air temperature
V_CC = 1.65 V to 1.95 V
V_CC = 2.3 V to 2.7 V
V_CC = 2.7 V to 3.6 V
V_CC = 1.65 V to 1.95 V
V_CC = 2.3 V to 2.7 V
V_CC = 2.7 V to 3.6 V
V_CC = 1.65 V
V_CC = 2.3 V
V_CC = 2.7 V
V_CC = 3 V
MIN
MAX
1.65
3.6
0.65 × V_CC
1.7
2
0.35 × V_CC
0.7
0.8
0
5.5
0
5.5
4
12
12
24
–40
125
UNIT
V
V
V
V
V
mA
°C
(1) All unused inputs of the device must be held at V_CC or GND to ensure proper device operation. See the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
2
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